Patent Assignment
Reel/Frame 011885/0773
Assignment of Assignor's Interest
Recorded: 2001-06-04
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR TECHNOLOGY CORP.
21F, NO. 88, SEC. 1 HSIN TAI WU ROAD HSICHIH, TAIPEI HSIEN 221, TAIWAN
Covered Property
(1)
Image Sensing Component Package and Manufacture Method Thereof
Related Assignments
(9)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Sep 12, 2002
From: TAIWAN SEMICONDUCTOR TECHNOLOGY CORP.
To: AMKOR TECHNOLOGY TAIWAN (LINKOU) LTD.
Reel/Frame 013282/0154 →
Assignment of Assignor's Interest
Jul 21, 2003
From: AMKOR TECHNOLOGY TAIWAN LTD.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 014291/0596 →
Change of Name
Jul 21, 2003
From: AMKOR TECHNOLOGY TAIWAN (LINKOU) LTD.
To: AMKOR TECHNOLOGY TAIWAN LTD.
Reel/Frame 014291/0598 →
Security Agreement
Jul 6, 2004
From: AMKOR TECHNOLOGY, INC.; GUARDIAN ASSETS, INC.
To: CITICORP NORTH AMERICA, INC. AS ADMINISTRATIVE AGENT
Reel/Frame 014885/0691 →
Security Agreement
Nov 2, 2004
From: AMKOR TECHNOLOGY, INC.; GUARDIAN ASSETS, INC.
To: CITICORP NORTH AMERICA, INC. AS "AGENT"
Reel/Frame 015942/0521 →
Termination & Release of Patent Security Agreement
Jan 3, 2006
From: CITICORP NORTH AMERICA, INC.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 017388/0868 →
Security Agreement
Jan 3, 2006
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 017379/0630 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →