Patent Assignment
Reel/Frame 012139/0410
Assignment of Assignor's Interest
Recorded: 2001-09-04
Pages: 4
Assignor
DRAFALL, LARRY E.
Executed: 2001-08-09
Assignee
MEMC ELECTRONIC MATERIALS, INC.
501 PEARL DRIVE, P.O. BOX 8, ST. PETERS, MISSOURI, 63376
Covered Property
(1)
Barium Doping of Molten Silicon for Use in Crystal Growing Process
Related Assignments
(15)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Nov 21, 2001
From: MEMC PASADENA, INC.; PLASMASIL, L.L.C.; SIBOND, L.L.C.; MEMC SOUTHWEST INC.
To: CITICORP USA, INC.
Reel/Frame 012280/0161 →
Security Interest
Nov 21, 2001
From: MEMC PASADENA, INC.; PLASMASIL, L.L.C.; SIBOND, L.L.C.; MEMC SOUTHWEST INC.
To: CITICORP USA, INC.
Reel/Frame 012273/0145 →
Termination of Security Interest
Nov 21, 2001
From: E.ON AG
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 012263/0944 →
Security Interest
Dec 27, 2001
From: MEMC ELECTRONIC MATERIALS, INC.
To: E. ON AG
Reel/Frame 012407/0806 →
Security Agreement
Dec 28, 2001
From: MEMC PASADENA, INC.; PLASMASIL, L.L.C.; SIBOND, L.L.C.; MEMC SOUTHWEST INC.
To: CITICORP USA, INC.
Reel/Frame 012365/0345 →
Security Agreement
Mar 19, 2003
From: MEMC ELECTRONIC MATERIALS, INC.; MEMC PASADENA, INC.; PLASMASIL, L.L.C.; SIBOND, L.L.C.
To: CITICORP USA, INC.
Reel/Frame 013964/0378 →
Release of Security Interest
Aug 11, 2005
From: CITICORP USA, INC.
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 016641/0045 →
Security Agreement
Apr 1, 2011
From: MEMC ELECTRONIC MATERIALS, INC.; SUNEDISON LLC; SOLAICX
To: BANK OF AMERICA, N.A.
Reel/Frame 026064/0720 →
Security Agreement
Oct 1, 2012
From: NVT, LLC; SUN EDISON LLC; SOLAICX, INC.; MEMC ELECTRONIC MATERIALS, INC.
To: GOLDMAN SACHS BANK USA
Reel/Frame 029057/0810 →
Release of Security Interest
Dec 26, 2013
From: GOLDMAN SACHS BANK USA
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0092 →
Release of Security Interest
Dec 26, 2013
From: BANK OF AMERICA, N.A.
To: ENFLEX CORPORATION; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0031 →
Security Agreement
Jan 30, 2014
From: SUNEDISON, INC.; SOLAICX; SUN EDISON, LLC; NVT, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 032177/0359 →
Release of Security Interest
Mar 3, 2014
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC.
Reel/Frame 032382/0724 →
Release of Security Interest to Reel/Frame: 012280/0161
Mar 17, 2014
From: CITICORP USA, INC.
To: MEMC ELECTRONIC MATERIALS, INC. (NOW KNOWN AS SUNEDISON, INC.); MEMC PASADENA, INC.; PLASMASIL, L.L.C.; SIBOND, L.L.C.
Reel/Frame 032458/0794 →
Assignment of Assignor's Interest
May 27, 2014
From: MEMC ELECTRONIC MATERIALS, INC.
To: SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H)
Reel/Frame 033023/0430 →