Patent Assignment
Reel/Frame 012337/0944
Assignment of Assignor's Interest
Recorded: 2001-11-30
Pages: 6
Assignors
OGAWA, HIROYUKI
Executed: 2001-11-27
WU, YIDER
Executed: 2001-11-27
SUN, YU
Executed: 2001-11-29
Assignees
ADVANCED MICRO DEVICES, INC.
P.O. BOX 3453, ONE AMD PLACE, SUNNYVALE, CALIFORNIA, 94088
FUJITSU LIMITED
NAKAHARA-KU, KAWASAKA-SHI, 1-1 KAMIKODANAKA, 4-CHOME, KANAGAWA, 211-88, JAPAN
Covered Property
(1)
Die Seal for Semiconductor Device Moisture Protection
Patent:
6,566,736 →
Application:
09/998,624 →
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 21, 2004
From: AMD INVESTMENTS, INC.; FUJITSU LIMITED
To: FASL, LLC
Reel/Frame 015487/0501 →
Assignment of Assignor's Interest
Jun 24, 2004
From: AMD (U.S.) HOLDINGS, INC.
To: AMD INVESTMENTS, INC.
Reel/Frame 015487/0599 →
Assignment of Assignor's Interest
Jun 24, 2004
From: ADVANCED MICRO DEVICES, INC.
To: AMD (U.S.) HOLDINGS, INC.
Reel/Frame 015487/0603 →
Change of Name
Apr 1, 2010
From: FASL LLC
To: SPANSION LLC
Reel/Frame 024170/0300 →
Security Agreement
Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
Release of Security Interest
Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
Assignment of Assignor's Interest
Jun 29, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036034/0230 →