IP Library › Assignment 012379/0506
Patent Assignment
Reel/Frame 012379/0506

Assignment of Assignor's Interest

Recorded: 2001-12-10 Pages: 2
Assignor
LEE, HYUNG JU
Executed: 2001-11-30
Assignee
AMKOR TECHNOLOGY, INC.
1900 S. PRICE ROAD, CHANDLER, ARIZONA, 85248
Covered Property (1)
Lead Frame for Semiconductor Package
Patent: 6,713,322 →
Application: 10/013,160 →
Publication: US 2002/0140061
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Nov 2, 2004
From: AMKOR TECHNOLOGY, INC.; GUARDIAN ASSETS, INC.
To: CITICORP NORTH AMERICA, INC. AS "AGENT"
Reel/Frame 015942/0521 →
Security Agreement Nov 2, 2004
From: AMKOR TECHNOLOGY, INC.; GUARDIAN ASSETS, INC.
To: CITICORP NORTH AMERICA, INC. AS AGENT
Reel/Frame 015320/0005 →
Security Agreement Jan 3, 2006
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 017379/0630 →
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →