Patent Assignment
Reel/Frame 012540/0961
Assignment of Assignor's Interest
Recorded: 2002-01-23
Pages: 5
Assignee
UNITIVE INTERNATIONAL LIMITED
CARACASBAAIWEG 201, CURACAO, NETHERLANDS
Covered Property
(1)
Methods of Forming Metallurgy Structures for Wire and Solder Bonding
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 1, 2002
From: UNITIVE INTERNATIONAL LIMITED
To: UNITIVE ELECTRONICS INC.
Reel/Frame 013341/0143 →
Security Agreement
Dec 27, 2005
From: UNITIVE, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 016937/0710 →
Assignment of Assignor's Interest
Jun 23, 2006
From: UNITIVE ELECTRONICS INC.
To: UNITIVE INTERNATIONAL LIMITED
Reel/Frame 017846/0057 →
Nunc Pro Tunc Assignment Effective 11/01/2012
Jan 9, 2013
From: UNITIVE INTERNATIONAL, LTD.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 029597/0452 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →