Patent Assignment
Reel/Frame 012703/0893
Assignment of Assignor's Interest
Recorded: 2002-03-13
Pages: 2
Assignor
MCCANN, DAVID
Executed: 2002-03-11
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85248
Covered Property
(1)
Flip-Chip Micromachine Package Using Seal Layer
Patent:
6,838,309 →
Application:
10/097,905 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Jan 3, 2006
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 017379/0630 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →