IP Library › Assignment 014022/0437
Patent Assignment
Reel/Frame 014022/0437

Bill of Sale and Instrument of Assignment and Assumption

Recorded: 2003-10-01 Pages: 14
Assignor
GOULD ELECTRONICS INC.
Executed: 2003-09-30
Assignee
NIKKO MATERIALS USA, INC.
125 NORTH PRICE ROAD, CHANDLER, ARIZONA, 85224
Covered Properties (93)
Process and Apparatus for Producing Surface Treated Metal Foil
Patent: 4,490,218 →
Application: 06/549,102 →
Anode for Continuous Electroforming of Metal Foil
Patent: 4,529,486 →
Application: 06/568,676 →
Metallized and Plated Laminates
Patent: 4,568,413 →
Application: 06/582,274 →
Method for Depositing a Micron-Size Metallic Film on a Transparent Substrate Utilizing a Visible Laser
Patent: 4,543,270 →
Application: 06/622,366 →
Method for Repairing a Photomask by Laser-Induced Polymer Degradation
Patent: 4,592,975 →
Application: 06/622,367 →
Method for Depositing a Micron-Size Metallic Film on a Transparent Substrate Utilizing a Laser
Patent: 4,606,932 →
Application: 06/748,515 →
Laser-Based System for the Total Repair of Photomasks
Patent: 4,727,234 →
Application: 06/879,751 →
In-Situ Dendritic Treatment of Electrodeposited Foil
Patent: 4,692,221 →
Application: 06/944,776 →
Cathode Surface Treatment for Electroforming Metallic Foil or Strip
Patent: 4,789,438 →
Application: 07/161,819 →
Method for Manufacturing Printed Circuit Board
Patent: 4,875,283 →
Application: 07/202,096 →
Copper-Chromium-Polyimide Composite
Patent: 4,863,808 →
Application: 07/209,069 →
Process and Apparatus for Electroplating Copper Foil
Patent: 4,898,647 →
Application: 07/288,472 →
Multilayer Film and Laminate for Use in Producing Printed Circuit Boards
Patent: 5,057,372 →
Application: 07/326,931 →
Electrodeposited Foil with Controlled Properties for Printed Circuit Board Applications and Procedures and Electrolyte Bath Solutions for Preparing the Same
Patent: 5,215,645 →
Application: 07/406,894 →
Apparatus and Process for the Production of Micro-Pore Free High Ductility Metal Foil
Patent: 4,956,053 →
Application: 07/410,770 →
Method of and Apparatus for Manufacturing Printed Circuit Boards
Patent: 5,256,474 →
Application: 07/435,769 →
Protected Conductive Foil Assemblage and Procedure for Preparing Same Using Static Electrical Forces
Patent: 5,167,997 →
Application: 07/501,093 →
Copper Foils for Printed Circuit Board Applications and Procedures and Electrolyte Bath Solutions for Electrodepositing the Same
Patent: 5,171,417 →
Application: 07/510,231 →
Method for Making Foil
Patent: 5,066,366 →
Application: 07/519,529 →
Surface Topography Optimization Through Control of Chloride Concentration in Electroformed Copper Foil
Patent: 5,181,770 →
Application: 07/537,215 →
Method for Printed Circuit Board Pattern Making Using Selectively Etchable Metal Layers
Patent: 5,017,271 →
Application: 07/572,849 →
Apparatus for Electrodepositing Metal
Patent: 5,393,396 →
Application: 07/605,648 →
Method and Apparatus for Applying Surface Treatment to Metal Foil
Patent: 5,228,965 →
Application: 07/606,051 →
Protected Conductive Foil and Procedure for Protecting an Electrodeposited Metallic Foil During Further Processing
Patent: 5,120,590 →
Application: 07/636,018 →
Component of Printed Circuit Boards
Patent: 5,153,050 →
Application: 07/750,798 →
Electrodeposited Copper Foil and Process for Making Same Using Electrolyte Solutions Having Low Chloride Ion Concentrations
Patent: 5,421,985 →
Application: 07/865,791 →
Method and Apparatus for Forming Printed Circuits
Patent: 5,242,562 →
Application: 07/888,788 →
Universal Carrier Supported Thin Copper Line
Patent: 5,322,975 →
Application: 07/947,711 →
Component of Printed Circuit Boards
Patent: 5,674,596 →
Application: 07/955,121 →
Method for Inhibiting the Electrodeposition of Organic Particulate Matter on Copper Foil
Patent: 5,840,170 →
Application: 07/982,999 →
Thin Plate Anode
Patent: 5,344,538 →
Application: 08/002,596 →
Anti-Oxidant Coatings for Copper Foils
Patent: 5,332,486 →
Application: 08/011,367 →
Process for Making Copper Foil
Patent: 5,366,612 →
Application: 08/049,176 →
Drum Cathode for Use in the Production of Metal Foils and a Method of Producing the Same
Patent: 5,372,297 →
Application: 08/056,186 →
Method of Etching Polyimide
Patent: 5,350,487 →
Application: 08/057,005 →
Method for Forming Printed Circuits by Elctroplating
Patent: 5,429,738 →
Application: 08/068,534 →
Electrodeposited Copper Foil and Process for Making Same Using Electrolyte Solutions Having Controlled Additions of Chloride Ions and Organic Additives
Patent: 5,403,465 →
Application: 08/068,690 →
Electrodeposited Copper Foil and Process for Making Same
Patent: 5,431,803 →
Application: 08/141,483 →
Foil with Adhesion Promoting Layer Derived from Silane Mixture
Patent: 5,622,782 →
Application: 08/264,192 →
Adhesive Compositions and Copper Foils and Copper Clad Lamiantes Using Same
Patent: 6,132,851 →
Application: 08/267,877 →
Process for Making Copper Metal Powder, Copper Oxides and Copper Foil
Patent: 5,458,746 →
Application: 08/287,703 →
Electrodeposited Copper Foil
Patent: 5,454,926 →
Application: 08/363,704 →
Epoxy Adhesives and Copper Foils and Copper Clad Laminates Using Same
Patent: 5,525,433 →
Application: 08/468,655 →
Multi-Layer Structures Containing a Silane Adhesion Promoting Layer
Patent: 5,614,324 →
Application: 08/505,741 →
Method and Apparatus for Sequentially Metalized Polymeric Films and Products Made Thereby
Patent: 5,685,970 →
Application: 08/515,910 →
Process for Making Copper Metal Powder, Copper Oxides and Copper Foil
Patent: 5,670,033 →
Application: 08/544,619 →
Epoxy Adhesives and Copper Foils and Copper Clad Laminates Using Same
Patent: 5,629,098 →
Application: 08/549,197 →
Method and Apparatus for Sequentially Metalizing Polymeric Films and Products Made Thereby
Patent: 5,716,502 →
Application: 08/604,450 →
Method for Forming Printed Circuits
Patent: 5,681,443 →
Application: 08/604,505 →
Process for Making Wire
Patent: 5,679,232 →
Application: 08/634,271 →
High Fatigue Ductility Electrodeposited Copper Foil
Patent: 6,132,887 →
Application: 08/647,706 →
Metallic Body with Vapor-Deposited Treatment Layer(S) and Adhesion-Promoting Layer
Patent: 5,709,957 →
Application: 08/713,100 →
Component of Printed Circuit Boards
Patent: 5,725,937 →
Application: 08/745,435 →
Component of Printed Circuit Boards
Patent: 5,951,803 →
Application: 08/789,169 →
Adhesiveless Flexible Laminate and Process for Making Adhesiveless Flexible Laminate
Patent: 6,171,714 →
Application: 08/832,097 →
Process for Treating a Metallic Body with Vapor-Deposited Treatment Layer(S) and Adhesion-Promoting Layer
Patent: 6,248,401 →
Application: 08/846,080 →
Non-Cyanide Brass Plating Bath and a Method of Making Metallic Foil Having a Brass Layer Using the Non-Cyanide Brass Plating Bath
Patent: 5,762,778 →
Application: 08/866,400 →
Metal Foil with Improved Bonding to Substrates and Method for Making the Foil
Patent: 5,908,542 →
Application: 08/887,393 →
Adhesion Enhancement for Metal Foil
Patent: 5,885,436 →
Application: 08/906,921 →
High Performance Flexible Laminate
Patent: 5,863,666 →
Application: 08/911,357 →
Metal Foil with Improved Peel Strength and Method for Making Said Foil
Patent: 6,042,711 →
Application: 08/920,405 →
Improved Zinc-Chromium Stabilizer Containing a Hydrogen Inhibiting Additive
Patent: 5,908,544 →
Application: 08/923,566 →
Method and Apparatus for Sequentially Metalizing Polymeric Films and Products Made Thereby
Patent: 5,944,965 →
Application: 08/925,220 →
Component of Printed Circuit Boards
Patent: 5,942,315 →
Application: 09/021,092 →
Adhesion Enhancement for Metal Foil
Patent: 6,086,743 →
Application: 09/124,836 →
Treated Copper Foil and Process for Making Treated Copper Foil
Patent: 6,132,589 →
Application: 09/150,643 →
Adhesion Promoting Layer for Use with Epoxy Prepregs
Patent: 6,117,536 →
Application: 09/151,220 →
Coatings for Improved Resin Dust Resistance
Patent: 6,299,721 →
Application: 09/211,283 →
Component of Printed Circuit Boards
Patent: 6,048,430 →
Application: 09/244,293 →
Copper Foil and Laminate Containing a Hydrogen Inhibitor
Patent: 6,168,703 →
Application: 09/259,848 →
Laminate for Multi-Layer Printed Circuit
Patent: 6,268,070 →
Application: 09/266,951 →
Flexible Laminate for Flexible Circuit
Patent: 6,146,480 →
Application: 09/266,952 →
Component of Printed Circuit Boards
Patent: 6,238,778 →
Application: 09/269,316 →
Surface Treatment of Copper to Prevent Microcracking in Flexible Circuits
Patent: 6,221,176 →
Application: 09/271,640 →
Method and Apparatus for Sequentially Metalizing Polymeric Films and Products Made Thereby
Patent: 6,224,722 →
Application: 09/276,392 →
Multi- Layer Laminate and Method of Producing Same
Patent: 6,103,135 →
Application: 09/277,101 →
Anode Structure for Manufacture of Metallic Foil
Patent: 6,183,607 →
Application: 09/337,576 →
Copper Coated Polyimide with Metallic Protective Layer
Patent: 6,296,949 →
Application: 09/397,404 →
Resin/Copper/Metal Laminate and Method of Producing Same
Patent: 6,376,008 →
Application: 09/400,392 →
Method of Forming Chromium Coated Copper for Printed Circuit Boards
Patent: 6,489,034 →
Application: 09/500,192 →
Treated Copper Foil and Process for Making Treated Copper Foil
Patent: 6,426,146 →
Application: 09/501,442 →
Sheet Stacking Device
Patent: 6,341,698 →
Application: 09/530,991 →
Component of printed circuit board
Patent: 6,379,487 →
Application: 09/566,289 →
Method of forming a flexible laminate for flexible circuit
Patent: 6,224,951 →
Application: 09/591,666 →
Electroforming cell
Patent: 6,361,673 →
Application: 09/604,630 →
Applying Resistive Layer Onto Copper
Patent: 6,489,035 →
Application: 09/628,766 →
Component for use in forming printed circuit boards
Patent: 6,316,733 →
Application: 09/641,303 →
Method and component for forming an embedded resistor in a multi-layer printed circuit
Patent: 6,284,982 →
Application: 09/641,304 →
Thin Copper on Usable Carrier and Method of Forming Same
Patent: 6,447,929 →
Application: 09/649,922 →
Resistor Component with Multiple Layers of Resistive Material
Patent: 6,622,374 →
Application: 09/667,294 →
Protective Coatings for Improved Tarnish Resistance in Metal Foils
Patent: 6,537,675 →
Application: 09/714,811 →
Coatings for Improved Resin Dust Resistance
Patent: 6,589,381 →
Application: 09/829,713 →
Publication: US 2001/0015257
Method of Making a Copper on Invar¿ Composite
Patent: 6,589,413 →
Application: 09/925,680 →
Publication: US 2003/0029730
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest. Nov 7, 1983
From: KADIJA, IGOR V.; OXLEY, JAMES E.
To: OLIN CORPORATION
Reel/Frame 004192/0816 →
Assignment of Assignors Interest. Jan 6, 1984
From: POLAN, NED W.
To: OLIN CORPORATION A CORP. OF VA
Reel/Frame 004216/0579 →
Assignment of Assignors Interest. Feb 22, 1984
From: TOTH, WILLIAM J.
To: TOTH JAMES J.
Reel/Frame 004231/0764 →
Assignment of Assignors Interest. Jun 20, 1984
From: YOUNG, PETER L.; OPRYSKO, MODEST M.; BERANEK, MARK W.
To: GOULD, INC. A CORP. OF DE
Reel/Frame 004276/0662 →
Assignment of Assignors Interest. Jun 20, 1984
From: BERANEK MARK W.; OPRYSKO, MODEST M.
To: GOULD INC. A CORP. OF DE
Reel/Frame 004276/0661 →
Security Interest Jul 15, 1988
From: LAMB-WESTON, INC., A DE CORP.
To: CHASE MANHATTAN BANK (NATIONAL ASSOCIATION) AS AGENT
Reel/Frame 004940/0634 →
Assignment of Assignors Interest. Dec 22, 1988
From: LUCE, BETTY M.; BERDAN, BETTY L.
To: GOULD INC., A DE CORP.
Reel/Frame 005004/0119 →
Assignment of Assignors Interest. Oct 26, 1989
From: DI FRANCO, DINO F.; CLOUSER, SIDNEY J.
To: GOULD INC.
Reel/Frame 005177/0603 →
Assignment of Assignors Interest. May 4, 1990
From: LIN, LIFUN
To: OLIN CORPORATION, A CORP. OF VA.
Reel/Frame 005313/0266 →
Assignment of Assignors Interest. May 7, 1990
From: CHAMBERLAIN, JAMIE H.; SAVAGE, ROLLAND D.; CALLAHAN, JOHN P.; BURGESS, DAVID P.
To: GOULD INC.
Reel/Frame 005299/0368 →
Assignment of Assignors Interest. May 29, 1990
From: DIFRANCO, DINO F.; CLOUSER, SIDNEY J.
To: GOULD INC., A DE CORP.
Reel/Frame 005320/0257 →
Assignment of Assignors Interest. Aug 24, 1990
From: WHEWELL, CHRISTOPHER J.; CLOUSER, SIDNEY J.; LEE, CHIN-HO
To: GOULD INC.
Reel/Frame 005421/0583 →
Assignment of Assignors Interest. Oct 30, 1990
From: AMEEN, THOMAS J.; BAY, ADAM G.; DE WITT, ROBERT D.
To: GOULD INC.
Reel/Frame 005495/0850 →
Assignment of Assignors Interest. Oct 30, 1990
From: DEWITT, ROBERT D.; BAY, ADAM G.; PARADAY, TIBOR
To: GOULD INC.
Reel/Frame 005501/0225 →
Assignment of Assignors Interest. Jul 30, 1991
From: IMFELD, STEPHEN M.; SHIPLEY, RANDALL S.
To: DOW CHEMICAL COMPANY, THE
Reel/Frame 005779/0779 →
Assignment of Assignors Interest. Sep 25, 1992
From: OLIN CORPORATION
To: GOULD INC.
Reel/Frame 006268/0355 →
Assignment of Assignors Interest. Oct 8, 1992
From: JOHNSTON, JAMES A.
To: JOHNSON & JOHNSTON ASSOCIATES, INC.
Reel/Frame 006298/0751 →
Security Interest Apr 15, 1993
From: JOHNSON & JOHNSTON ASSOCIATES, INC.
To: GOULD INC.
Reel/Frame 006507/0245 →
Assignment of Assignor's Interest Feb 16, 1994
From: GOULD INC.
To: GOULD ELECTRONICS INC.
Reel/Frame 006865/0444 →
Assignment of Assignor's Interest Feb 16, 1994
From: GOULD INC.
To: GOULD ELECTRONICS INC.
Reel/Frame 006869/0106 →
Amended and Restated Patent Assignment and Security Agreement Jun 17, 1996
From: JOHNSON & JOHNSON ASSOCIATES, INC.
To: GOULD ELECTRONICS INC.
Reel/Frame 007969/0682 →
Assignment of Assignor's Interest Feb 23, 1998
From: TOTH, JAMES J.
To: GOULD ELECTRONICS INC.
Reel/Frame 009005/0001 →
Assignment of Assignor's Interest Dec 21, 1998
From: DOW CHEMICAL COMPANY, THE
To: GOULD ELECTRONICS INC.
Reel/Frame 009648/0354 →
Security Interest Mar 24, 2000
From: JOHNSON & JOHNSTON ASSOCIATES, INC.
To: KEYBANK NATIONAL ASSOCIATION
Reel/Frame 010696/0661 →
Security Agreement Mar 24, 2000
From: JOHNSON & JOHNSTON ASSOCIATES, INC.
To: KEYBANK NATIONAL ASSOCIATION
Reel/Frame 010696/0605 →