Patent Assignment
Reel/Frame 014116/0297
Corrective to Correct the Second Assignor's Name and the Assignee's Address Previously Recorded at Reel 013659 Frame 0991. (Assignment of Assignor's Interest)
Recorded: 2003-06-02
Pages: 3
Assignors
LI, JIAN JUN
Executed: 2002-09-09
SHIM, II KWON
Executed: 2002-09-10
BADAKERE, GURUPRASAD
Executed: 2002-09-09
Assignee
ST ASSEMBLY TEST SERVICES LTD.
5 YISHUN ST. 23, 768442, SINGAPORE
Covered Property
(1)
Integrated Circuit Package and Manufacturing Method Therefor
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 19, 2002
From: LI, JIAN JUN; SHIM, IL KWON; BADAKERE, GURUPRASAD
To: ST ASSEMBLY TEST SERVICES LTD.
Reel/Frame 013659/0991 →
Change of Name
Aug 6, 2015
From: ST ASSEMBLY TEST SERVICES LTD.
To: STATS CHIPPAC LTD.
Reel/Frame 036286/0590 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0400 →
Release of Security Interest
Jun 16, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052950/0497 →
Corrective Assignment to Correct the Assignee's Name Previously Recorded at Reel: 038378 Frame: 0400. Assignor(S) Hereby Confirms the Assignment.
Sep 5, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064806/0593 →