Integrated circuit package and manufacturing method therefor with unique interconnector

1. A method for manufacturing an integrated circuit comprising:

providing a substrate having solder openings provided therein and a conductive layer thereon;

processing the conductive layer to form a plurality of pads over the solder openings in the substrate;

depositing a mask over the plurality of pads;

forming openings in the mask over at least two pads of the plurality of pads;

bonding an integrated circuit die over the substrate using a conductive adhesive; and

placing the conductive adhesive in the openings in conductive contact with the at least two pads of the plurality of pads.

2. The method as claimed in claim 1 wherein processing the conductive layer uses a metal layer bonded to or integrally deposited on the substrate.

3. The method as claimed in claim 1 wherein placing the conductive adhesive in the openings in the mask includes flowing the conductive adhesive under bonding pressure between the substrate and the integrated circuit die.

4. The method as claimed in claim 1 additionally comprising:

bonding a conductive plane over the substrate and under the integrated circuit die, the bonding using the conductive adhesive and providing conductive contact between the conductive adhesive and the conductive plane.

5. The method as claimed in claim 1 additionally comprising:

bonding a conductive plane over the substrate, the bonding using the conductive adhesive and providing conductive contact between the conductive adhesive and the conductive plane; and

bonding the integrated circuit die to the conductive plane.

6. A method for manufacturing an integrated circuit comprising:

providing a substrate having solder openings provided therein and a metal layer thereon;

processing the metal layer to form a plurality of pads over the solder openings in the substrate;

depositing a soldermask over the plurality of pads;

forming openings in the soldermask over at least two pads of the plurality of pads;

bonding an integrated circuit die over the substrate using a conductive die attach adhesive; and

placing the conductive die attach adhesive in the openings in the soldermask and in conductive contact with the at least two pads of the plurality of pads.

7. The method as claimed in claim 6 wherein processing the metal layer uses a metal layer bonded to or integrally deposited on the substrate.

8. The method as claimed in claim 6 wherein placing the conductive die attach adhesive in the openings in the soldermask includes flowing the conductive die attach adhesive under bonding pressure between a ground plane and the substrate.

9. The method as claimed in claim 6 wherein:

processing the metal layer forms a power cross-connect connecting two power pads of the plurality of pads; and

additionally comprising:

bonding a ground plane over the substrate and under the integrated circuit die, the ground plane, the bonding using the conductive die attach adhesive and providing conductive contact between the conductive die attach adhesive and the ground plane.

10. The method as claimed in claim 6 wherein:

processing the metal layer forms a power cross-connect connecting two power pads of the plurality of pads; and

additionally comprising:

bonding a ground plane over the substrate, the bonding using the conductive die attach adhesive and providing conductive contact between the conductive die attach adhesive and the ground plane; and

bonding the integrated circuit die to the ground plane.