Patent Assignment
Reel/Frame 014126/0003
Assignment of Assignor's Interest
Recorded: 2003-05-23
Pages: 3
Assignee
ST ASSEMBLY TEST SERVICES LTD.
23 YISHUN ST. 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Moisture Resistant Integrated Circuit Leadframe Package
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Assignee's Address. Document Previously Recorded on Reel 014126 Frame 0003, Assignor Hereby Confirms the Assignment.
Nov 25, 2003
From: HAN, BYUNG JOON; AHN, BYUNG HOON
To: ST ASSEMBLY TEST SERVICES LTD.
Reel/Frame 014728/0660 →
Change of Name
Aug 6, 2015
From: ST ASSEMBLY TEST SERVICES LTD.
To: STATS CHIPPAC LTD.
Reel/Frame 036286/0590 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0400 →
Release of Security Interest
Jun 16, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052950/0497 →
Corrective Assignment to Correct the Assignee's Name Previously Recorded at Reel: 038378 Frame: 0400. Assignor(S) Hereby Confirms the Assignment.
Sep 5, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064806/0593 →