IP Library Assignment 014249/0803
Patent Assignment
Reel/Frame 014249/0803

Assignment of Assignor's Interest

Recorded: 2003-07-07 Pages: 3
Assignors
DELAMARCHE, EMMANUEL
Executed: 2003-02-24
DESPONT, MICHEL
Executed: 2003-02-24
DRECHSLER, UTE
Executed: 2003-02-24
GEISSLER, MATTHIAS
Executed: 2003-02-24
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Selective Filling of Electrically Conductive Vias for Three Dimensional Device Structures
Patent: 6,770,558 →
Application: 10/371,466 →
Publication: US 2003/0219970
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 17, 2014
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: ULTRATECH, INC.
Reel/Frame 033122/0154 →
Assignment of Assignor's Interest Dec 30, 2019
From: ULTRATECH, INC.
To: VEECO INSTRUMENTS INC.
Reel/Frame 051446/0476 →
Patent Security Agreement Dec 16, 2021
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 058533/0321 →
Security Interest Jun 16, 2025
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 071649/0225 →