Patent Assignment
Reel/Frame 014395/0551
Assignment of Assignor's Interest
Recorded: 2003-08-15
Pages: 2
Assignor
NEC ELECTRONICS CORPORATION
Executed: 2003-07-23
Assignee
FAB SOLUTIONS, INC.
5F, 3-5-7 HISAMOTO, TAKATSU-KU, NISSEI SHINMIZONOKUHI BLDG., KAWASAKI, KANAGAWA 213-0001, JAPAN
Covered Properties
(2)
Method and Apparatus for Measuring Thickness of Thin Film
Film Thickness Measuring Apparatus and a Method for Measuring a Thickness of a Film
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 6, 2003
From: ITAGAKI, YOSUKE; YAMADA, KEIZO; USHIKI, TAKEO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 013643/0803 →
Assignment of Assignor's Interest
Jan 15, 2003
From: YAMADA, KEIZO; ITAGAKI, YOUSUKE; USHIKI, TAKEO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 013661/0840 →
Assignment of Assignor's Interest
Jun 1, 2007
From: FAB SOLUTIONS, INC.
To: TOPCON CORPORATION
Reel/Frame 019365/0356 →