Patent Assignment
Reel/Frame 019365/0356
Assignment of Assignor's Interest
Recorded: 2007-06-01
Pages: 3
Assignor
FAB SOLUTIONS, INC.
Executed: 2007-05-21
Assignee
TOPCON CORPORATION
75-1 HASUNUMA-CHO, ITABASHI-KU, TOKYO, 174-8580, JAPAN
Covered Properties
(4)
Semiconductor Manufacturing Apparatus
Patent:
6,614,050 →
Application:
09/696,272 →
Method and Apparatus for Measuring Thickness of Thin Film
Film Thickness Measuring Apparatus and a Method for Measuring a Thickness of a Film
Film Thickness Measuring Apparatus and a Method for Measuring a Thickness of a Film
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 25, 2000
From: YAMADA, KEIZO; TSUJIDE, TOHORU
To: NEC CORPORATION
Reel/Frame 011250/0798 →
Security Agreement
Jul 30, 2001
From: TIMBREL SYSTEMS CORP.
To: L.L.L.M.P. FINANCIAL MANAGEMENT, L.L.C.
Reel/Frame 012022/0874 →
Assignment of Assignor's Interest
Jan 6, 2003
From: NEC CORPORATION
To: FAB SOLUTIONS, INC.
Reel/Frame 013636/0191 →
Assignment of Assignor's Interest
Jan 6, 2003
From: ITAGAKI, YOSUKE; YAMADA, KEIZO; USHIKI, TAKEO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 013643/0803 →
Assignment of Assignor's Interest
Jan 15, 2003
From: YAMADA, KEIZO; ITAGAKI, YOUSUKE; USHIKI, TAKEO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 013661/0840 →
Assignment of Assignor's Interest
Aug 15, 2003
From: NEC ELECTRONICS CORPORATION
To: FAB SOLUTIONS, INC.
Reel/Frame 014395/0551 →