Patent Assignment
Reel/Frame 014787/0769
Assignment of Assignor's Interest
Recorded: 2004-06-28
Pages: 2
Assignor
TSENG, SHIEN CHUN
Executed: 2004-02-17
Assignee
POWERCHIP SEMICONDUCTOR CORP.
NO. 12, LI-HSIN RD. I, SCIENCE-BASED INDUSTRIAL, PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Method for Fabricating a Through Hole on a Semiconductor Substrate
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jun 24, 2019
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 049562/0154 →
Assignment of Assignor's Interest
Jul 14, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049746/0981 →
Assignment of Assignor's Interest
Apr 8, 2020
From: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 052337/0735 →
Assignment of Assignor's Interest
Sep 7, 2020
From: POWERCHIP TECHNOLOGY CORPORATION
To: NEXCHIP SEMICONDUCTOR CORPORATION
Reel/Frame 053704/0522 →