IP Library Assignment 014887/0008
Patent Assignment
Reel/Frame 014887/0008

Assignment of Assignor's Interest

Recorded: 2004-01-15 Pages: 3
Assignor
KIM, IN-SU
Executed: 2003-12-03
Assignee
DONGBU ELECTRONICS CO., LTD.
891-10, DAECHI-DONG, GANGNAM-GU, SEOUL, KOREA, REPUBLIC OF
Covered Property (1)
Methods of Manufacturing Semiconductor Devices
Patent: 6,943,092 →
Application: 10/729,227 →
Publication: US 2004/0126991
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger May 31, 2005
From: DONGBU SEMICONDUCTOR INC.
To: DONGBUANAM SEMICONDUCTOR, INC.
Reel/Frame 016593/0667 →
Change of Name Jun 6, 2006
From: DONGBU ANAM SEMICONDUCTORS, INC
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017718/0964 →
Merger and Change of Name Nov 29, 2017
From: DONGBU ELECTRONICS CO., LTD.; DONGBU HITEK CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 044533/0523 →
Change of Name Nov 30, 2017
From: DONGBU HITEK CO., LTD.
To: DB HITEK CO., LTD
Reel/Frame 044555/0913 →
Assignment of Assignor's Interest Jul 10, 2019
From: DB HITEK CO., LTD.
To: COLUMBA TECHNOLOGIES INC.
Reel/Frame 049709/0857 →