Patent Assignment
Reel/Frame 015073/0570
Assignment of Assignor's Interest
Recorded: 2004-09-03
Pages: 4
Assignor
SIEMENS AKTIENGESELLSCHAFT
Executed: 2004-09-01
Assignee
INFINEON TECHNOLOGIES AG
ST.-MARTIN-STR. 53, MUNICH, 81669, GERMANY
Covered Properties
(2)
Energy Relieving Crack Stop
Patent:
5,834,829 →
Application:
08/706,586 →
Semiconductor Device Structure with Hydrogen-Rich Layer for Facilitating Passivation of Surface States
Patent:
6,483,172 →
Application:
09/562,217 →
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 5, 1996
From: DINKEL, BETTINA A.
To: SIEMENS COMPONENTS, INC.
Reel/Frame 008152/0801 →
Assignment of Assignor's Interest
Nov 18, 2004
From: SIEMENS AKTIENGESELLSCHAFT
To: INFINEON TECHNOLOGIES AG
Reel/Frame 015386/0643 →
Assignment of Assignor's Interest
Mar 11, 2008
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 020627/0141 →
Assignment of Assignor's Interest
May 28, 2010
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 024456/0001 →
Assignment of Assignor's Interest
May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →