Patent Assignment
Reel/Frame 015601/0084
Assignment of Assignor's Interest
Recorded: 2003-09-18
Pages: 2
Assignors
IMORI, TORU
Executed: 2003-08-14
SEKIGUCHI, JUNNOSUKE
Executed: 2003-08-14
YABE, ATSUSHI
Executed: 2003-08-14
Assignee
NIKKO MATERIALS CO., LTD.
10-1, TORANOMON 2-CHOME, MINATO-KU, TOKYO 105-8407, JAPAN
Covered Property
(1)
Electroless Plating Method and Semiconductor Wafer on Which Metal Plating Layer Is Formed
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Sep 27, 2006
From: NIKKO MATERIALS CO., LTD.
To: NIPPON MINING & METALS CO., LTD.
Reel/Frame 018303/0546 →
Change of Name/Merger
Jun 9, 2011
From: NIPPON MINING & METALS CO., LTD.
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 026417/0023 →
Change of Address
Feb 7, 2017
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 041649/0733 →
Change of Address
Aug 11, 2021
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 057160/0114 →