Patent Assignment
Reel/Frame 015928/0638
Assignment of Assignor's Interest
Recorded: 2004-10-22
Pages: 3
Assignor
LEE, JAE-SUK
Executed: 2004-10-22
Assignee
DONGBU ELECTRONICS CO., LTD., A KOREAN CORPORATION
891-10 DAECHI-DONG, GANGNAM-GU, SEOUL, 135-523, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices and Methods of Fabricating the Same
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
May 31, 2005
From: DONGBU SEMICONDUCTOR INC.
To: DONGBUANAM SEMICONDUCTOR, INC.
Reel/Frame 016593/0667 →
Change of Name
Jun 6, 2006
From: DONGBU ANAM SEMICONDUCTORS, INC
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017718/0964 →
Merger and Change of Name
Nov 29, 2017
From: DONGBU ELECTRONICS CO., LTD.; DONGBU HITEK CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 044533/0523 →
Change of Name
Nov 30, 2017
From: DONGBU HITEK CO., LTD.
To: DB HITEK CO., LTD
Reel/Frame 044555/0913 →
Assignment of Assignor's Interest
Jul 10, 2019
From: DB HITEK CO., LTD.
To: COLUMBA TECHNOLOGIES INC.
Reel/Frame 049709/0857 →