IP Library Assignment 016318/0654
Patent Assignment
Reel/Frame 016318/0654

Assignment of Assignor's Interest

Recorded: 2005-07-27 Pages: 4
Assignors
CHONG, FU CHIUNG
Executed: 2005-05-24
KAO, ANDREW S.
Executed: 2005-05-20
MCKAY, DOUGLAS
Executed: 2005-05-23
LITZA, ANNA
Executed: 2005-05-20
MODLIN, DOUGLAS
Executed: 2005-05-19
MOK, SAMMY
Executed: 2005-05-20
PAREKH, NITIN S
Executed: 2005-05-23
SWIATOWIEC, FRANK J
Executed: 2005-05-23
SHAN, ZHAOHUI
Executed: 2005-05-20
Assignee
NANONEXUS, INC.
2520 JUNCTION AVENUE, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
High Density Interconnect System Having Rapid Fabrication Cycle
Patent: 7,382,142 →
Application: 11/133,021 →
Publication: US 2005/0275418
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Lien Sep 5, 2008
From: NANONEXUS, INC.
To: GLENN PATENT GROUP
Reel/Frame 021489/0108 →
Lien Release Dec 23, 2008
From: GLENN PATENT GROUP
To: NANONEXUS, INC.
Reel/Frame 022024/0219 →
Assignment of Assignor's Interest Jul 7, 2010
From: NANONEXUS, INC.
To: NANONEXUS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
Reel/Frame 024640/0291 →
Assignment of Assignor's Interest Jul 7, 2010
From: NANONEXUS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
To: VERIGY (SINGAPORE) PTE. LTD.
Reel/Frame 024640/0301 →
Assignment of Assignor's Interest Mar 20, 2012
From: VERIGY (SINGAPORE) PTE LTD
To: ADVANTEST (SINGAPORE) PTE LTD
Reel/Frame 027896/0018 →