IP Library Assignment 016396/0081
Patent Assignment
Reel/Frame 016396/0081

Assignment of Assignor's Interest

Recorded: 2005-08-12 Pages: 6
Assignors
LEE, SANG HO
Executed: 2005-08-11
JU, JONG WOOK
Executed: 2005-08-11
KARNEZOS, MARCOS
Executed: 2005-08-09
Assignee
CHIPPAC, INC.
47400 KATO ROAD, FREMONT, CALIFORNIA, 94538
Covered Property (1)
Adhesive/Spacer Island Structure for Stacking Over Wire Bonded Die
Patent: 8,552,551 →
Application: 11/134,845 →
Publication: US 2005/0269676
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger and Change of Name Aug 6, 2015
From: CHIPPAC, INC.; STATS CHIPPAC, INC.
To: STATS CHIPPAC, INC.
Reel/Frame 036286/0612 →
Security Interest Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name Apr 7, 2016
From: STATS CHIPPAC LTD
To: STATS CHIPPAC PTE. LTE
Reel/Frame 038378/0200 →
Release of Security Interest Jun 4, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052844/0491 →