Patent Assignment
Reel/Frame 016533/0061
Notice of Grant of Security Interest
Recorded: 2005-09-14
Pages: 5
Assignor
TTM TECHNOLOGIES, INC.
Executed: 2005-07-15
Assignee
WACHOVIA BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
201 SOUTH COLLEGE STREET, CP-8, CHARLOTTE, NORTH CAROLINA, 28288
Covered Property
(1)
Method for Analyzing Material Density Variations on a Multi-Layer Printed Circuit Board
Related Assignments
(14)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 23, 2004
From: CAMERON, ANDREW JAMES
To: TTM TECHNOLOGIES, INC.
Reel/Frame 014288/0541 →
Merger
Sep 1, 2005
From: TTM TECHNOLOGIES, INC., A CORP. OF WASHINGTON
To: TTM TECHNOLOGIES, INC., A CORP. OF DELAWARE
Reel/Frame 016709/0323 →
Merger
Sep 1, 2005
From: TTM TECHNOLOGIES, INC., A WASHINGTON CORPORATION
To: TTM TECHNOLOGIES, INC., A DELAWARE CORPORATION
Reel/Frame 016704/0547 →
Patent Security Agreement
Oct 27, 2006
From: TTM ADVANCED CIRCUITS, INC.
To: UBS AG, STAMFORD BRANCH
Reel/Frame 018442/0594 →
Termination of Security Interests in Patents (Releases R/F: 016533-0061)
Oct 27, 2006
From: WACHOVIA BANK, NATIONAL ASSOCIATION
To: TTM TECHNOLOGIES, INC.
Reel/Frame 018448/0779 →
First Supplement to Patent Security Agreement
Apr 8, 2008
From: TTM TECHNOLOGIES, INC.
To: UBS AG, STAMFORD BRANCH, AS COLLATERAL AGENT
Reel/Frame 020773/0067 →
Release of Security Interest
Jul 16, 2008
From: UBS AG, STAMFORD BRANCH
To: TTM TECHNOLOGIES, INC.
Reel/Frame 021249/0944 →
Release of Security Agreement
Jul 21, 2008
From: UBS AG, STAMFORD BRANCH
To: TTM ADVANCED CIRCUITS, INC.
Reel/Frame 021266/0276 →
Patent Security Agreement-Abl
Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035858/0890 →
Patent Security Agreement-Term
Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035851/0928 →
Patent Security Agreement (Term Loan)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
Patent Security Agreement (Abl)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (063804/0702)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075679/0852 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (035858/0890)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TTM TECHNOLOGIES, INC. (FORMERLY KNOWN AS VIASYSTEMS GROUP, INC. AND VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (FORMERLY KNOWN AS VIASYSTEMS TECHNOLOGIES CORP., L.L.C.)
Reel/Frame 075681/0922 →