Patent Assignment
Reel/Frame 016693/0343
Re-Record to Correct the Serial Number on a Document Previously Recorded at Reel 016069, Frame 0098. (Change of Name)
Recorded: 2005-06-15
Pages: 9
Assignor
RYODEN SEMICONDUCTOR SYSTEM ENGINEERING CORPORATION
Executed: 2003-04-01
Assignee
RENESAS SEMICONDUCTOR ENGINEERING CORP.
1 MIZUHARA 4-CHOME, ITAMI-SHI, HYOGO, 664-0005, JAPAN
Covered Property
(1)
Apparatus and Method for Testing Semiconductor Integrated Circuit
Related Assignments
(8)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 13, 2001
From: MORI, HISAYA; YAMADA, SHINJI; FUNAKURA, TERUHIKO
To: MITSUBISHI DENKI KABUSHIKI KAISHA; RYODEN SEMICONDUCTOR SYSTEM ENGINEERING CORPORATION
Reel/Frame 012067/0336 →
Assignment of Assignor's Interest
Sep 10, 2003
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 014502/0289 →
Change of Name
Dec 13, 2004
From: RYODEN SEMICONDUCTOR SYSTEM ENGINEERING CORPORATION
To: RENESAS SEMICONDUCTOR ENGINEERING CORPORATION
Reel/Frame 016069/0098 →
Change of Name
Sep 13, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024973/0598 →
Merger
Jun 13, 2017
From: RENESAS SEMICONDUCTOR ENGINEERING CORPORATION
To: RENESAS NAKA SEMICONDUCTOR CORPORATION
Reel/Frame 042692/0192 →
Change of Name
Sep 13, 2017
From: RYODEN SEMICONDUCTOR SYSTEM ENGINEERING CORPORATION
To: RENESAS SEMICONDUCTOR ENGINEERING CORPORATION
Reel/Frame 043583/0156 →
Merger
Sep 19, 2017
From: RENESAS NAKA SEMICONDUCTOR CORPORATION
To: RENESAS SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 043902/0816 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →