Patent Assignment
Reel/Frame 016759/0301
Assignment of Assignor's Interest
Recorded: 2005-11-09
Pages: 3
Assignors
ONG, YOU YANG
Executed: 2005-10-13
CHUNG, KWANG YONG
Executed: 2005-10-13
AHMAD, MOHD HELMY BIN
Executed: 2005-10-13
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Integrated Circuit Package System Including Ribbon Bond Interconnect
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 15, 2008
From: ONG, YOU YANG; CHUNG, KWANG YONG; BIN AHMAD, MOHD HELMY; WONG, GARRETT L.
To: STATS CHIPPAC LTD.; ORTHODYNE ELECTRONICS CORPORATION
Reel/Frame 021397/0485 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0319 →
Release of Security Interest
Jun 15, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052938/0305 →
Correct Error in Assignment Name from Stats Chippac, Pte. Lte to Stats Chippac Pte. Ltd (Reel: 038378 Frame: 0319)
Aug 30, 2023
From: STATS CHIPPAC PTE. LTE.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064760/0986 →