Patent Assignment
Reel/Frame 021397/0485
Assignment of Assignor's Interest
Recorded: 2008-08-15
Pages: 7
Assignors
ONG, YOU YANG
Executed: 2007-08-06
CHUNG, KWANG YONG
Executed: 2007-08-06
BIN AHMAD, MOHD HELMY
Executed: 2007-08-06
WONG, GARRETT L.
Executed: 2007-08-09
LUECHINGER, CHRISTOPH B.
Executed: 2007-08-09
Assignees
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
ORTHODYNE ELECTRONICS CORPORATION
16700 RED HILL AVENUE, IRVINE, CALIFORNIA, 92608
Covered Property
(1)
Integrated Circuit Package System Including Ribbon Bond Interconnect
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 9, 2005
From: ONG, YOU YANG; CHUNG, KWANG YONG; AHMAD, MOHD HELMY BIN
To: STATS CHIPPAC LTD.
Reel/Frame 016759/0301 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0319 →
Release of Security Interest
Jun 15, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052938/0305 →
Correct Error in Assignment Name from Stats Chippac, Pte. Lte to Stats Chippac Pte. Ltd (Reel: 038378 Frame: 0319)
Aug 30, 2023
From: STATS CHIPPAC PTE. LTE.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064760/0986 →