Integrated circuit package system including ribbon bond interconnect
View Patent ↗An integrated circuit package system including a ribbon bond interconnect is provided, having a semiconductor device with at least one pad thereon. An external connection is provided. A heavy ribbon is provided and bonded to the external connection and to the pad on the semiconductor device.
1. An integrated circuit package system including a ribbon bond interconnect, comprising:
providing a semiconductor device having at least one pad thereon;
providing an external connection;
providing a heavy ribbon; and
bonding the heavy ribbon to the external connection and to the pad on the semiconductor device, the bonding providing mesh-stitches on the heavy ribbon.
2. The system of claim 1 wherein bonding further comprises bonding with a plurality of stitches to at least the external connection or the pad on the semiconductor device.
3. The system of claim 1 wherein bonding further comprises bonding with a plurality of continuous stitches.
4. The system of claim 1 wherein the heavy ribbon has a cross-sectional dimension of at least 40 mil×4 mil.
5. The system of claim 1 wherein bonding further comprises applying a bond force distributed substantially evenly to and over the heavy ribbon along a predetermined portion thereof and across substantially the whole width thereof.
6. An integrated circuit package system including a ribbon bond interconnect, comprising:
providing a semiconductor device having at least one pad thereon;
providing an external pad;
providing a heavy aluminum or aluminum-alloy ribbon; and bonding the heavy aluminum or aluminum-alloy ribbon to the external pad and to the pad on the semiconductor device, the bonding having criss-crossing mesh-stitches to bond the heavy aluminum or aluminum-alloy ribbon to the external pad and the at least one pad.
7. The system of claim 6 wherein bonding further comprises bonding with a plurality of stitches to at least the external pad or the pad on the semiconductor device.
8. The system of claim 6 wherein bonding further comprises bonding with a plurality of continuous ultrasonic stitch bonds.
9. The system of claim 6 wherein the heavy aluminum or aluminum-alloy ribbon has a cross-sectional dimension of at least 40 mil×4 mil.
10. The system of claim 6 wherein bonding further comprises applying a bond force distributed substantially evenly to and over the heavy aluminum or aluminum-alloy ribbon along a predetermined portion thereof and across substantially the whole width thereof.
11. An integrated circuit package system including a ribbon bond interconnect, comprising:
a semiconductor device having at least one pad thereon;
an external connection; and
a heavy ribbon bonded to the external connection and to the pad on the semiconductor device, the heavy ribbon bond having mesh-stitches to bond the heavy ribbon to the pad.
12. The system of claim 11 further comprising a plurality of stitches bonding the heavy ribbon to at least the external connection or the pad on the semiconductor device.
13. The system of claim 11 wherein the heavy ribbon is bonded with a plurality of continuous stitches.
14. The system of claim 11 wherein the heavy ribbon has a cross-sectional dimension of at least 40 mil×4 mil.
15. The system of claim 11 wherein the heavy ribbon has the characteristics of bonding by applying a bond force distributed substantially evenly to and over the heavy ribbon along a predetermined portion thereof and across substantially the whole width thereof.
16. An integrated circuit package system including a ribbon bond interconnect, comprising:
a semiconductor device having at least one pad thereon;
an external pad;
a heavy aluminum or aluminum-alloy ribbon bonded to the external pad and to the pad on the semiconductor device, the heavy ribbon bond having criss-crossing mesh-stitches to bond the heavy aluminum or alunimum-alloy ribbon to the external pad and the at least one pad.
17. The system of claim 16 further comprising a plurality of stitches bonding the heavy aluminum or aluminum-alloy ribbon to at least the external pad or the pad on the semiconductor device.
18. The system of claim 16 wherein the heavy aluminum or aluminum-alloy ribbon is bonded with a plurality of continuous ultrasonic stitch bonds.
19. The system of claim 16 wherein the heavy aluminum or aluminum-alloy ribbon has a cross-sectional dimension of at least 40 mil×4 mil.
20. The system of claim 16 wherein the heavy aluminum or aluminum-alloy ribbon has the characteristics of bonding by applying a bond force distributed substantially evenly to and over the heavy aluminum or aluminum-alloy ribbon along a predetermined portion thereof and across substantially the whole width thereof.