Patent Assignment
Reel/Frame 016844/0668
Assignment of Assignor's Interest
Recorded: 2005-09-30
Received: 2005-09-30
Pages: 3
Assignor
SENSYS INSTRUMENTS CORPORATION
Executed: 2005-09-27
Assignee
THERMA-WAVE, INC.
1250 RELIANCE WAY, FREMONT, CA, 94539, UNITED STATES
Covered Properties
(10)
Method of Measuring Meso-Scale Structures on Wafers
Application:
10/919,718 →
Integrated Surface Metrology
Application:
10/654,073 →
Method of Measuring Meso-Scale Structures on Wafers
Application:
10/621,218 →
Method of Measuring Meso-Scale Structures on Wafers
Application:
09/999,410 →
Optimized Aperture Shape for Optical Cd/Profile Metrology
Application:
09/938,415 →
Small-Spot Spectrometry Instrument with Reduced Polarization
Application:
09/932,548 →
Notch and Flat Sensor for Wafer Alignment
Application:
09/932,786 →
Bathless Wafer Measurement Apparatus and Method
Application:
09/927,142 →
Optical critical dimension metrology system integrated into semiconductor wafer process tool
Application:
09/927,102 →
Method of Detecting Residue on a Polished Wafer
Application:
09/800,306 →