Patent Assignment
Reel/Frame 016920/0329
Assignment of Assignor's Interest
Recorded: 2005-02-18
Pages: 4
Assignors
KNAPP, JAMES
Executed: 2004-09-10
CARNEY, FRANCIS
Executed: 2004-09-10
ANDERSON, HAROLD
Executed: 2004-09-24
WEN, YENTENG
Executed: 2004-09-10
NGO, CANG
Executed: 2004-09-10
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, L.L.C. OF
5005 EAST MCDOWELL ROAD, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Semiconductor Device with Wire Bond Inductor and Method
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Sep 10, 2007
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 019795/0808 →
Release of Security Interest
Sep 4, 2014
From: JPMORGAN CHASE BANK, N.A.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 033686/0092 →
Security Interest
Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
Corrective Assignment to Correct the Incorrect Patent Number 5859768 and to Recite Collateral Agent Role of Receiving Party in the Security Interest Previously Recorded on Reel 038620 Frame 0087. Assignor(S) Hereby Confirms the Security Interest.
Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
Release of Security Interest in Patents Recorded at Reel 038620, Frame 0087
Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →