Semiconductor device with wire bond inductor and method
View Patent ↗A semiconductor device ( 10 ) includes a semiconductor die ( 20 ) and an inductor ( 30, 50 ) formed with a bonding wire ( 80 ) attached to a top surface ( 21 ) of the semiconductor die. The bonding wire is extended laterally a distance (L 30 , L 150 ) greater than its height (H 30 , H 50 ) to define an insulating core ( 31, 57 ). In one embodiment, the inductor is extended beyond an edge ( 35, 39 ) of the semiconductor die to reduce loading.
1. A semiconductor device, comprising:
a semiconductor die having first and second bonding pads formed on a major surface and further having first and second edges; and
a first inductor including a first bonding wire attached at one end to the first bonding pad and at a second end to the second bonding pad, wherein the first inductor extends laterally a distance greater than a height of the bonding wire to define an insulating core, and wherein the first inductor projects laterally over the first edge at least at two locations.
2. The semiconductor device of claim 1 , wherein the insulating core is centered along an axis substantially perpendicular to the major surface.
3. The semiconductor device of claim 1 , further comprising:
first and second leads in spaced relationship with the semiconductor die; and
a second inductor including a second bonding wire attached at one end to the first lead and attached at a second end to the second lead.
4. The semiconductor device of claim 1 , wherein the first bonding wire is formed with a coil chat surrounds the insulating core, and wherein the insulating core is substantially centered along an axis running parallel to the first edge.
5. The semiconductor device of claim 4 , further comprising a second inductor including a second bonding wire attached at a first end to a third bonding pad on the semiconductor die and at a second end to a fourth bonding pad on the semiconductor die, wherein the second inductor extends laterally a distance greater than a height of the second bonding wire to define a second insulating core centered along an axis substantially perpendicular to the major surface.
6. The semiconductor device of claim 5 , wherein the first bonding wire has an inductance greater than about five nanohenries.
7. The semiconductor device of claim 1 , further comprising a semiconductor package for housing the semiconductor die and the first inductor.
8. The semiconductor device of claim 7 , further comprising a second bonding wire attached between a third bonding pad of the semiconductor die and a lead of the semiconductor package.
9. The semiconductor device of claim 7 , wherein the semiconductor package includes an encapsulant for providing the insulating core and for maintaining a position of the coil.
10. The semiconductor device of claim 1 , wherein the first bonding ware provides an inductance and the semiconductor die includes an oscillator operating at a frequency determined by the inductance.
11. The semiconductor device of claim 10 , wherein the frequency is greater than two gigahertz.
12. The semiconductor device of claim 1 , wherein the bonding wire has a substantially circular cross-section.
13. A semiconductor device, comprising:
a semiconductor die having a plurality of bonding pads on a major surface and an edge; and
a first inductor comprising a first bonding wire formed in a coil around a dielectric core and having a first end coupled to a first bonding pad on the major surface and a second end coupled to a second bonding pad on the major surface, and wherein the first inductor projects over the edge a lateral distance greater than its height, and wherein the first inductor projects laterally over the edge at least at two locations.
14. The semiconductor device of claim 13 , wherein the dielectric core is centered along an axis substantially perpendicular to the major surface.
15. The semiconductor device of claim 13 , wherein the dielectric core is substantially centered along an axis running parallel to the edge.
16. The semiconductor device of claim 13 , further comprising a semiconductor package for housing the semiconductor die and the bonding wire and having a lead that provides the surface for attaching the bonding wire.
17. The semiconductor device of claim 3 , wherein the second inductor comprises a coil conductor.
18. The semiconductor device of claim 13 , further comprising:
first and second leads in spaced relationship with the semiconductor die, each coupled to the semiconductor die; and
a second inductor including a second bonding wire attached at one end to the first lead and attached at a second end to the second lead.