Patent Assignment
Reel/Frame 017371/0181
Assignment of Assignor's Interest
Recorded: 2006-03-27
Pages: 6
Assignors
LEE, MING HSUN
Executed: 2006-03-20
YU, CHEEMEN
Executed: 2006-03-15
TAKIAR, HEM
Executed: 2006-03-15
Assignee
SANDISK CORPORATION
140 CASPIAN COURT, SUNNYVALE, CALIFORNIA, 94089
Covered Property
(1)
Col-Tsop with Nonconductive Material for Reducing Package Capacitance
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 2, 2011
From: SANDISK CORPORATION
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 026378/0691 →
Change of Name
May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038809/0472 →
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →