Patent Assignment
Reel/Frame 017480/0927
Assignment of Assignor's Interest
Recorded: 2006-04-18
Pages: 16
Assignor
UNISYS CORPORATION
Executed: 2006-03-16
Assignee
DELTA DESIGN, INC.
12367 CROSTHWAITE CIRCLE, POWAY, CALIFORNIA, 92064
Covered Properties
(48)
Electro-Mechanical Subassembly Having a Greatly Reduced Thermal Resis Tance Between Two Mating Faces by Including a Film of Liquid, That Evaporates Without Leaving Any Residue, Between the Faces
Patent:
5,864,176 →
Application:
08/833,273 →
Temperature Control System for an Electronic Device in Which Device Temperature Is Estimated from Heater Temperature and Heat Sink Temperature
Patent:
5,844,208 →
Application:
08/833,368 →
Temperature Control System for an Electronic Device Which Achieves a Quick Response by Interposing a Heater Between the Device and a Heat Sink
Patent:
5,821,505 →
Application:
08/833,369 →
Testing Assembly Having a Pressed Joint with a Single Layer of Thermal Conductor Which Is Reused to Sequentially Test Multiple Circuit Modules
Patent:
6,108,208 →
Application:
08/986,772 →
Residue-Free Method of Assembling and Disassembling a Pressed Joint with Low Thermal Resistance
Patent:
6,243,944 →
Application:
08/986,923 →
Method of Thermally Coupling an Electronic Device to a Heat Exchange Member While Said Electronic Device Is Being Tested
Patent:
5,918,665 →
Application:
09/173,580 →
Mechanical Assembly for Regulating the Temperture of an Electronic Device Which Incorporates a Heat Exchanger That Contacts an Entire Planar Face on the Device Except for Its Corners
Patent:
6,196,299 →
Application:
09/210,259 →
Mechanical Assembly for Regulating the Temperature of an Electronic Device Which Incorporates at Least Two Leaf Springs for Self-Alignment Plus a Low Initial Contact Force and a Low Profile
Patent:
6,179,047 →
Application:
09/210,264 →
Mechanical Assembly for Regulating the Temperature of an Electronic Device Which Incorporates a Single Leaf Spring for Self-Alignment Plus a Low Initial Contact Force and a Low Profile
Patent:
6,116,331 →
Application:
09/210,266 →
Electronic System for Testing a Set of Multiple Chips Concurrently or Sequentially in Selectable Subsets Under Program Control to Limit Chip Power Dissipation
Patent:
6,363,504 →
Application:
09/386,945 →
Electronic System for Testing Chips Having a Selectable Number of Pattern Generators That Concurrently Broadcast Different Bit Streams to Selectable Sets of Chip Driver Circuits
Patent:
6,363,510 →
Application:
09/386,946 →
Program Storage Device Containing Instructions That Are Spaced Apart by Unused Bits That End on Word Boundaries and Which Generate Chip Testing Bit Streams of Any Length
Patent:
6,405,150 →
Application:
09/387,197 →
Multi-Stage Algorithmic Pattern Generator for Testing Ic Chips
Patent:
6,415,408 →
Application:
09/432,965 →
System for Testing Ic Chips Selectively with Stored or Internally Generated Bit Streams
Patent:
6,415,409 →
Application:
09/432,966 →
Output Stage of a Multi-Stage Algorithmic Pattern Generator for Testing Ic Chips
Patent:
6,480,981 →
Application:
09/432,967 →
Intermediate Stage of a Multi-Stage Algorithmic Pattern Generator for Testing Ic Chips
Patent:
6,477,676 →
Application:
09/432,968 →
Initial Stage of a Multi-Stage Algorithmic Pattern Generator for Testing Ic Chips
Patent:
6,571,365 →
Application:
09/432,969 →
Electromechanical apparatus for testing IC chips using first and second sets of substrates which are pressed together
Patent:
6,307,388 →
Application:
09/511,789 →
Planar Subassembly for Testing Ic Chips Having Faces with Pressed Electrical Contacts That Carry All Power and Signals for the Chips
Pivoting springy mechanism that opens and closes pressed electrical contacts with a force which is nearly constant over a range of closed positions
Patent:
6,307,391 →
Application:
09/511,791 →
Apparatus for testing IC Chips using a sliding springy mechanism which exerts a nearly constant force
Patent:
6,325,662 →
Application:
09/511,792 →
System for Regulating the Temperature of Ic-Chips with a Fluid Which Is Heated and Cooled as a Function of the Fluid Temperatures to and from Heat Exchangers for the Ic-Chips
Patent:
6,412,551 →
Application:
09/574,784 →
System for regulating the temperature of ic-chips with a fluid whose temperature is controlled quickly by a slow response cooler and a fast response heater
Patent:
6,362,944 →
Application:
09/575,346 →
Connector for making multiple pressed co-axial connections having an air dielectric
Patent:
6,247,939 →
Application:
09/639,308 →
Connector for sending power to an IC-chip thru four pressed joints in series
Patent:
6,302,703 →
Application:
09/686,039 →
Connector for sending power to an ic-chip thru two pressed joints in series
Patent:
6,336,815 →
Application:
09/754,507 →
Power System Having Pressed Electrical Contacts and Which Detects Faults in the Contacts
Patent:
6,496,010 →
Application:
09/779,420 →
Method of Fabricating an Alloy Film on a Face of a Heat Exchanger for an Integrated Circuit
Mechanical Assembly for Fabricating an Alloy Film on a Face of a Heat Exchanger for an Integrated Circuit
Patent:
6,478,076 →
Application:
09/912,842 →
Integrated Circuit Tester Having a Fail-Safe Mechanism for Moving Ic-Chips
Patent:
6,581,486 →
Application:
09/976,416 →
Method of Fabricating a Heat Exchanger, for Regulating the Temperature of Multiple Integrated Cicuit Modules, Having a Face of a Solid Malleable Metal Coated with a Release Agent
Patent:
6,658,736 →
Application:
10/215,992 →
Method and Apparatus for Regulating the Temperature of Integrated Circuit Modules, Using a Heat Exchager with a Face of a Solid Malleable Metal and a Release Agent
Patent:
6,822,465 →
Application:
10/215,993 →
Abrupt Power Change Method of Preventing an Integrated Circuit Chip from Being Thermally Destroyed, in a Tester, Due to a Defective Pressed Joint
Patent:
6,809,543 →
Application:
10/391,884 →
Initial Contact Method of Preventing an Integrated Circuit Chip from Being Thermally Destroyed, in a Tester, Due to a Defective Pressed Joint
Patent:
6,774,661 →
Application:
10/391,887 →
Method of Extending the Operational Period of a Heat-Exchanger in a Chip Tester
Patent:
7,004,243 →
Application:
10/625,051 →
Chip Tester Having a Heat-Exchanger with an Extendable Period of Operation
Patent:
6,914,446 →
Application:
10/625,064 →
Temperature Control System Which Sprays Liquid Coolant Droplets Against an Ic-Module at a Sub-Atmospheric Pressure
Temperature Control System Which Sprays Liquid Coolant Droplets Against an Ic-Module and Directs Radiation Against the Ic-Module
System for Testing Multiple Groups of Ic-Chips Which Concurrently Sends Time-Shifted Test Signals to the Groups
Patent:
6,909,299 →
Application:
10/705,368 →
System for Testing a Group of Ic-Chips Having a Chip Holding Subassembly That Is Built-in and Loaded/Unloaded Automatically
System for Testing One or More Groups of Ic-Chips While Concurrently Loading/Unloading Another Group
Electromechanical Module, for Holding Ic-Chips in a Chip Testing System, That Synchronizes and Translates Test Signals to the Ic-Chips
Patent:
6,958,617 →
Application:
10/759,910 →
Single-Transistor Two Resistor Circuit Which Translate Test Signals to Selectable Voltage Levels
Patent:
6,970,009 →
Application:
10/759,917 →
Dual Feedback Control System for Maintaining the Temperature of an Ic-Chip Near a Set-Point
Method of Controlling the Operation of a Digital State Machine from a Master Controller in an Ic-Chip Testing System
Patent:
6,979,997 →
Application:
10/850,281 →
Mechanical Assembly, for Regulating the Temperature of an Ic-Chip, Having a Gimbaled Heat-Exchanger with Coiled Springy Conduits
Patent:
7,373,967 →
Application:
10/879,245 →
Mechanical Assembly for Regulating the Temperature of an Electronic Device, Having a Spring with One Slideable End
Method of Automatically Carrying Ic-Chips, on a Planar Array of Vacuum Nozzles, to a Variable Target in a Chip Tester
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 24, 2001
From: MORANGE, BLANQUITA ORTEGA
To: UNISYS CORPORATION
Reel/Frame 012048/0168 →
Patent Security Agreement
Oct 1, 2018
From: DELTA DESIGN, INC.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 047640/0566 →
Corrective Assignment to Correct the Incorrect Statement That This Document Serves as an Oath/Declaration Previously Recorded on Reel 047640 Frame 0566. Assignor(S) Hereby Confirms the Patent Security Agreement.
Jan 2, 2019
From: DELTA DESIGN, INC.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 048003/0306 →
Termination and Release of Security Interest in Patents Recorded at Reel 047640, Frame 0566
Mar 7, 2024
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS AGENT
To: DELTA DESIGN, INC.
Reel/Frame 066762/0857 →