Patent Assignment
Reel/Frame 018519/0358
Assignment of Assignor's Interest
Recorded: 2006-11-14
Pages: 4
Assignors
BOTTOMS, W. R.
Executed: 2006-10-06
CHONG, FU CHIUNG
Executed: 2006-10-06
MOK, SAMMY
Executed: 2006-09-30
MODLIN, DOUGLAS
Executed: 2006-10-06
Assignee
NANONEXUS CORPORATION
2520 JUNCTION AVENUE, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
High Density Interconnect System for Ic Packages and Interconnect Assemblies
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Lien
Sep 5, 2008
From: NANONEXUS, INC.
To: GLENN PATENT GROUP
Reel/Frame 021489/0108 →
Lien Release
Dec 23, 2008
From: GLENN PATENT GROUP
To: NANONEXUS, INC.
Reel/Frame 022024/0219 →
Assignment of Assignor's Interest
Jul 7, 2010
From: NANONEXUS, INC.
To: NANONEXUS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
Reel/Frame 024640/0291 →
Assignment of Assignor's Interest
Jul 7, 2010
From: NANONEXUS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
To: VERIGY (SINGAPORE) PTE. LTD.
Reel/Frame 024640/0301 →
Assignment of Assignor's Interest
Mar 20, 2012
From: VERIGY (SINGAPORE) PTE LTD
To: ADVANTEST (SINGAPORE) PTE LTD
Reel/Frame 027896/0018 →