Patent Assignment
Reel/Frame 018598/0674
Assignment of Assignor's Interest
Recorded: 2006-12-07
Pages: 5
Assignors
LEE, HUN TEAK
Executed: 2006-11-22
LEE, TAE KEUN
Executed: 2006-11-22
PARK, SOO JUNG
Executed: 2006-11-22
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Integrated Circuit Package System Employing Thin Profile Techniques
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0309 →
Release of Security Interest
Jun 15, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052935/0327 →
Corrective Assignment to Correct the the Assignee's Name Previously Recorded at Reel: 038378 Frame: 0309. Assignor(S) Hereby Confirms the Assignment.
Sep 11, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 065236/0767 →
Assignment of Assignor's Interest
Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →