Integrated circuit package system employing thin profile techniques
An integrated circuit package system that includes: providing an electrical interconnect system including a first lead-finger system and a second lead-finger system; stacking a second device over a first device between the first lead-finger system and the second lead-finger system; connecting the second device to the second lead-finger system with a bump bond; stacking a dummy device over the second device; and connecting the first device to the first lead-finger system with a wire bond.
1. A method of manufacture of an integrated circuit package system comprising:
providing an electrical interconnect system including a first lead-finger system and a second lead-finger system;
stacking a second device over a first device between the first lead-finger system and the second lead-finger system;
connecting the second device to the second lead-finger system with a bump bond;
stacking a dummy device over the second device; and
connecting the first device to the first lead-finger system with a wire bond.
2. The method as claimed in claim 1 wherein:
stacking the dummy device over the second device includes stacking an inactive semiconductor die/package, a spacer, an electromagnetic interference shield, a thermally conductive layer, or a combination thereof.
3. The method as claimed in claim 1 wherein:
stacking the dummy device over the second device provides structural rigidity to the integrated circuit package system.
4. The method as claimed in claim 1 wherein:
stacking the second device includes offsetting the second device to expose a portion of a first device active side and a second device active side.
5. The method as claimed in claim 1 further comprising:
providing a first inter-device structure between the first device and the second device and a second inter-device structure between the second device and the dummy device.
6. A method of manufacture of an integrated circuit package system comprising:
providing an electrical interconnect system and a first device attached to a support medium;
stacking a second device over the first device;
connecting the second device to a second lead-finger system of the electrical interconnect system with a bump bond;
stacking a dummy device over the second device;
connecting the first device to a first lead-finger system of the electrical interconnect system;
depositing an encapsulation material; and
removing the support medium.
7. The method as claimed in claim 6 wherein:
stacking the second device over the first device allows the second lead-finger system to be placed underneath the second device.
8. The method as claimed in claim 6 further comprising:
configuring the integrated circuit package system to be part of an integrated circuit package-on-package system.
9. The method as claimed in claim 6 further comprising:
configuring the integrated circuit package system to be part of an integrated circuit package-in-package system.
10. The method as claimed in claim 6 further comprising:
exposing a portion of a dummy device top side.
11. An integrated circuit package system comprising:
an electrical interconnect system including a first lead-finger system and a second lead-finger system;
a second device over a first device between the first lead-finger system and the second lead-finger system;
a bump bond between the second device and the second lead-finger system;
a dummy device over the second device; and
a wire bond between the first device and the first lead-finger system.
12. The system as claimed in claim 11 wherein:
the dummy device includes an inactive semiconductor die/package, a spacer, an electromagnetic interference shield, a thermally conductive layer, or a combination thereof.
13. The system as claimed in claim 11 wherein:
the dummy device provides structural rigidity to the integrated circuit package system.
14. The system as claimed in claim 11 wherein:
the second device is offset from the first device to expose a portion of a first device active side and a second device active side.
15. The system as claimed in claim 11 further comprising:
a first inter-device structure between the first device and the second device and a second inter-device structure between the second device and the dummy device.
16. The system as claimed in claim 15 wherein:
the first inter-device structure and the second inter-device structure may be selected from an adhesive with or without thermally conducting capabilities, a spacer, an electromagnetic interference shield, or a combination thereof.
17. The system as claimed in claim 11 wherein:
the second lead-finger system is underneath the second device.
18. The system as claimed in claim 11 wherein:
the integrated circuit package system is part of an integrated circuit package-on-package system.
19. The system as claimed in claim 11 wherein:
the integrated circuit package system is part of an integrated circuit package-in-package system.
20. The system as claimed in claim 11 further comprising:
a portion of a dummy device top side exposed.