Patent Assignment
Reel/Frame 018914/0306
Assignment of Assignor's Interest
Recorded: 2007-02-20
Pages: 6
Assignors
RINNE, GLENN A.
Executed: 2007-01-23
ENGEL, KEVIN
Executed: 2007-02-13
ROE, JULIA
Executed: 2007-01-24
BERRY, CHRISTOPHER JOHN
Executed: 2007-02-13
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85248-1604
Covered Property
(1)
Methods of Forming Back Side Layers for Thinned Wafers
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
Jun 3, 2009
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 022764/0864 →
Patent Security Agreement
Dec 6, 2012
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 029422/0178 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →