IP Library Assignment 019061/0539
Patent Assignment
Reel/Frame 019061/0539

Assignment of Assignor's Interest

Recorded: 2007-03-22 Pages: 10
Assignors
BLAIS, CLAUDE
Executed: 2007-03-16
DUCHESNE, ERIC
Executed: 2007-03-15
LEE, KANG-WOOK
Executed: 2007-03-19
OUIMET, SYLVAIN
Executed: 2007-03-15
SCILLA, GERALD J.
Executed: 2007-03-21
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Method of Removing Metallic, Inorganic and Organic Contaminants from Chip Passivation Layer Surfaces
Patent: 7,771,541 →
Application: 11/689,570 →
Publication: US 2008/0233755
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 10, 2014
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: ULTRATECH, INC.
Reel/Frame 031941/0821 →
Assignment of Assignor's Interest Dec 30, 2019
From: ULTRATECH, INC.
To: VEECO INSTRUMENTS INC.
Reel/Frame 051383/0735 →
Assignment of Assignor's Interest Dec 30, 2019
From: ULTRATECH, INC.
To: VEECO INSTRUMENTS INC.
Reel/Frame 051446/0476 →
Patent Security Agreement Dec 16, 2021
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 058533/0321 →
Security Interest Jun 16, 2025
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 071649/0225 →