Patent Assignment
Reel/Frame 019322/0159
Assignment of Assignor's Interest
Recorded: 2007-05-21
Pages: 5
Assignors
KANG, TAEWOO
Executed: 2007-05-09
LEE, YORIM
Executed: 2007-05-09
LEE, TAEKEUN
Executed: 2007-05-09
Assignee
STATS CHIPPAC, LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Standoff Height Improvement for Bumping Technology Using Solder Resist
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0319 →
Release of Security Interest
Jun 15, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052935/0327 →
Correct Error in Assignment Name from Stats Chippac, Pte. Lte to Stats Chippac Pte. Ltd (Reel: 038378 Frame: 0319)
Aug 30, 2023
From: STATS CHIPPAC PTE. LTE.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064760/0986 →
Assignment of Assignor's Interest
Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →