Patent Assignment
Reel/Frame 019633/0537
Assignment of Assignor's Interest
Recorded: 2007-08-01
Pages: 6
Assignors
KIM, YOON JOO
Executed: 2007-07-19
KIM, JAE YUN
Executed: 2007-07-19
NA, SEOK HO
Executed: 2007-07-19
CHUNG, JI YOUNG
Executed: 2007-07-19
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85286-6604
Covered Property
(1)
Semiconductor Device Having a Stacked Bump to Reduce Kirkendall Voids and or Cracks and Method of Manufacturing
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
Jun 3, 2009
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 022764/0864 →
Patent Security Agreement
Dec 6, 2012
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 029422/0178 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →