Semiconductor device having a stacked bump to reduce kirkendall voids and or cracks and method of manufacturing
View Patent ↗A semiconductor device has a semiconductor die having at least one bond pad formed on a first surface thereof. A substrate has at least one bond finger formed on a first surface thereof. A second surface of the semiconductor die is attached to the first surface of the substrate. A conductive wire connects the bond pad of the semiconductor die and the bond finger of the substrate wherein at least one end of the conductive wire has a stack bump. An encapsulant is provided to encapsulate the semiconductor die and the conductive wire.
1. A semiconductor device comprising:
a semiconductor die having at least one bond pad formed on a first surface thereof;
a substrate having at least one bond finger formed on a first surface thereof, a second surface of the semiconductor die attached to the first surface of the substrate;
a bump formed on the at least one bond pad, wherein impurities are added to the bump;
a conductive wire connecting the bond pad of the semiconductor die and the bond finger of the substrate, the conductive wire having a ball bond formed on a first end, the ball bond attached to the bump;
an impurity added in different concentrations to the bump and the conductive wire, wherein the bump and the conductive wire are formed from a same metal and having different purities, the conductive wire being of a higher purity than the bump; and
an encapsulant encapsulating the semiconductor die and the conductive wire.
2. A semiconductor device in accordance with claim 1 , further comprising a stitch bond attaching a second end of the conductive wire to the at least one bond finger.
3. A semiconductor device in accordance with claim 1 , wherein the conductive wire is of a higher purity than the bump to reduce an intermetallic compound (IMC) that results in kirkendall void or crack between the bond pad and the conductive wire.
4. A semiconductor device in accordance with claim 3 , wherein at least one of the bump and the conductive wire includes one of Ca and Be.
5. A semiconductor device in accordance with claim 1 , wherein the impurity may be one selected from the group consisting of Ca, Be, Ce, Pd, Mg, La, Y, Cu, Fe, or combinations thereof.
6. A semiconductor device in accordance with claim 2 , wherein the bump is made of Au and at least one of Be, La, Y, or combinations thereof is added to the bump as an impurity, and
the conductive wire are made of Au and at least one of Ca, Ce, Pd, Mg, Cu, Fe, and combinations thereof is added to them as an impurity.
7. A semiconductor device in accordance with claim 2 , wherein the bump and the ball bond of the stacked bump are made of different metals.
8. A semiconductor device in accordance with claim 2 , wherein the bump is made of Au and the ball bond is made of Cu in the stack bump.
9. A semiconductor device in accordance with claim 2 , wherein at least one of the bond pad and the bond finger is ball-bonded with the bump.
10. A semiconductor device in accordance with claim 9 , wherein at least one of the bond pad and the bond finger is stitch-bonded with the conductive wire.
11. A semiconductor device comprising:
a semiconductor die having at least one bond pad formed on a first surface thereof;
a substrate having at least one bond finger formed on a first surface thereof, a second surface of the semiconductor die attached to the first surface of the substrate;
a conductive wire connecting the bond pad of the semiconductor die and the bond finger of the substrate;
means coupled to at least one end of the conductive wire to reduce an intermetallic compound (IMC) that results in kirkendall void or crack between a bond pad and the conductive wire; and
an encapsulant encapsulating the semiconductor die and the conductive wire;
an impurity added in different concentrations to the means and the conductive wire, wherein the means and the conductive wire is formed from a same metal having different purities, the conductive wire being of a higher purity.
12. A semiconductor device in accordance with claim 11 , wherein the means comprises a stack bump having a bump and a ball bond stacked on the bump and connected to the conductive wire, wherein the bump is formed of a metal different from that of the bond pad.
13. A semiconductor device in accordance with claim 12 , wherein the conductive wire having a higher purity than the bump to reduce an intermetallic compound (IMC) that results in kirkendall void or crack between the bond pad and the conductive wire.
14. A semiconductor device comprising:
a semiconductor die having at least one bond pad formed on a first surface thereof;
a substrate having at least one bond finger formed on a first surface thereof, a second surface of the semiconductor die attached to the first surface of the substrate;
a conductive wire connecting the bond pad of the semiconductor die and the bond finger of the substrate wherein at least one end of the conductive wire has a stack bump having a bump and a ball bond stacked on the bump and connected to the conductive wire, wherein the bump is formed of a metal different from that of the bond pad; and
an impurity added in different concentrations to the bump and the conductive wire, wherein the bump and the conductive wire are formed from a same metal, the conductive wire being of a higher purity than the bump due to the impurity added;
an encapsulant encapsulating the semiconductor die and the conductive wire.
15. A semiconductor device in accordance with claim 14 , wherein the bump and the conductive wire is formed from a same metal having different purity.
16. A semiconductor device in accordance with claim 14 , wherein at least one of the bump and the conductive wire is made of the same metal, wherein impurities added to the at least one of the bump and the conductive wire are different to each other to minimize an intermetallic compound (IMC) that results in kirkendall void or crack between the bond pad and the conductive wire.