Patent Assignment
Reel/Frame 021064/0716
Security Agreement
Recorded: 2008-06-10
Pages: 5
Assignor
MERIX CORPORATION
Executed: 2008-05-09
Assignee
BANK OF AMERICA, N.A.
2001 CLAYTON ROAD, CA4-702-02-25, CONCORD, CALIFORNIA, 94520-2405
Covered Properties
(3)
Microelectronic Substrates with Thermally Conductive Pathways and Methods of Making Same
PCT:
PCT/US2004/014209 ↗
Air-Dielectric Stripline
Patent:
5,712,607 →
Application:
08/631,580 →
Microelectronic Substrates with Thermally Conductive Pathways and Methods of Making Same
Related Assignments
(11)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Agreement
Oct 7, 2005
From: MERIX CORPORATION
To: WACHOVIA CAPITAL FINANCE CORPORATION (WESTERN), AS AGENT
Reel/Frame 016628/0248 →
Assignment of Assignor's Interest
Dec 4, 2006
From: JOHNSON, BENNY H.
To: MERIX CORPORATION
Reel/Frame 018682/0192 →
Release of Security Interest
Jun 10, 2008
From: WACHOVIA CAPITAL FINANCE CORPORATION
To: MERIX CORPORATION
Reel/Frame 021071/0635 →
Security Agreement
Feb 22, 2010
From: MERIX CORPORATION
To: WACHOVIA CAPITAL FINANCE CORPORATION (NEW ENGLAND)
Reel/Frame 023974/0017 →
Change of Name
May 14, 2010
From: MERIX CORPORATION
To: VIASYSTEMS CORPORATION
Reel/Frame 024391/0575 →
Security Agreement
May 4, 2012
From: VIASYSTEMS, INC.; VIASYSTEMS CORPORATION
To: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 028158/0575 →
Patent Security Agreement-Abl
Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035858/0890 →
Release of Security Interest
Jun 8, 2015
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: VIASYSTEMS, INC.; VIASYSTEMS CORPORATION (FORMERLY MERIX CORPORATION)
Reel/Frame 035858/0092 →
Release of Security Interest
Jun 8, 2015
From: WACHOVIA CAPITAL FINANCE CORPORATION (NEW ENGLAND)
To: MERIX CORPORATION
Reel/Frame 035857/0333 →
Patent Security Agreement-Term
Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035851/0928 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (035858/0890)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TTM TECHNOLOGIES, INC. (FORMERLY KNOWN AS VIASYSTEMS GROUP, INC. AND VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (FORMERLY KNOWN AS VIASYSTEMS TECHNOLOGIES CORP., L.L.C.)
Reel/Frame 075681/0922 →