Patent Assignment
Reel/Frame 021071/0635
Release of Security Interest
Recorded: 2008-06-10
Pages: 4
Assignor
WACHOVIA CAPITAL FINANCE CORPORATION
Executed: 2008-05-08
Assignee
MERIX CORPORATION
1521 POPLAR LANE, FOREST GROVE, OREGON, 97116
Covered Property
(1)
Microelectronic Substrates with Thermally Conductive Pathways and Methods of Making Same
Related Assignments
(11)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Oct 7, 2005
From: MERIX CORPORATION
To: WACHOVIA CAPITAL FINANCE CORPORATION (WESTERN), AS AGENT
Reel/Frame 016628/0248 →
Assignment of Assignor's Interest
Dec 4, 2006
From: JOHNSON, BENNY H.
To: MERIX CORPORATION
Reel/Frame 018682/0192 →
Security Agreement
Jun 10, 2008
From: MERIX CORPORATION
To: BANK OF AMERICA, N.A.
Reel/Frame 021064/0716 →
Security Agreement
Feb 22, 2010
From: MERIX CORPORATION
To: WACHOVIA CAPITAL FINANCE CORPORATION (NEW ENGLAND)
Reel/Frame 023974/0017 →
Change of Name
May 14, 2010
From: MERIX CORPORATION
To: VIASYSTEMS CORPORATION
Reel/Frame 024391/0575 →
Security Agreement
May 4, 2012
From: VIASYSTEMS, INC.; VIASYSTEMS CORPORATION
To: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 028158/0575 →
Patent Security Agreement-Abl
Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035858/0890 →
Release of Security Interest
Jun 8, 2015
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: VIASYSTEMS, INC.; VIASYSTEMS CORPORATION (FORMERLY MERIX CORPORATION)
Reel/Frame 035858/0092 →
Release of Security Interest
Jun 8, 2015
From: WACHOVIA CAPITAL FINANCE CORPORATION (NEW ENGLAND)
To: MERIX CORPORATION
Reel/Frame 035857/0333 →
Patent Security Agreement-Term
Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035851/0928 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (035858/0890)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TTM TECHNOLOGIES, INC. (FORMERLY KNOWN AS VIASYSTEMS GROUP, INC. AND VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (FORMERLY KNOWN AS VIASYSTEMS TECHNOLOGIES CORP., L.L.C.)
Reel/Frame 075681/0922 →