Patent Assignment
Reel/Frame 023974/0017
Security Agreement
Recorded: 2010-02-22
Pages: 13
Assignor
MERIX CORPORATION
Executed: 2010-02-16
Assignee
WACHOVIA CAPITAL FINANCE CORPORATION (NEW ENGLAND)
150 SOUTH WACKER DRIVE, CHICAGO, ILLINOIS, 60606
Covered Properties
(9)
Electrical Connector
Patent:
4,255,003 →
Application:
06/007,445 →
Fractionating Liquids
Patent:
4,394,219 →
Application:
06/287,035 →
Packing Unit and Method of Making
Patent:
4,600,544 →
Application:
06/553,949 →
Multilayer Interconnect Circuitry Using Photoimagenable Dielectric
Patent:
4,566,186 →
Application:
06/626,560 →
Probe Cable Assembly
Patent:
4,716,500 →
Application:
06/789,278 →
Flexible Circuit Strain Relief
Patent:
4,756,940 →
Application:
06/843,952 →
Process for Removal of Dissolved Copper from Solution
Patent:
4,950,326 →
Application:
07/345,865 →
Air-Dielectric Stripline
Patent:
5,712,607 →
Application:
08/631,580 →
Microelectronic Substrates with Thermally Conductive Pathways and Methods of Making Same
Related Assignments
(10)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 4, 2006
From: JOHNSON, BENNY H.
To: MERIX CORPORATION
Reel/Frame 018682/0192 →
Release of Security Interest
Jun 10, 2008
From: WACHOVIA CAPITAL FINANCE CORPORATION
To: MERIX CORPORATION
Reel/Frame 021071/0635 →
Security Agreement
Jun 10, 2008
From: MERIX CORPORATION
To: BANK OF AMERICA, N.A.
Reel/Frame 021064/0716 →
Change of Name
May 14, 2010
From: MERIX CORPORATION
To: VIASYSTEMS CORPORATION
Reel/Frame 024391/0575 →
Security Agreement
May 4, 2012
From: VIASYSTEMS, INC.; VIASYSTEMS CORPORATION
To: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 028158/0575 →
Patent Security Agreement-Abl
Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035858/0890 →
Release of Security Interest
Jun 8, 2015
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: VIASYSTEMS, INC.; VIASYSTEMS CORPORATION (FORMERLY MERIX CORPORATION)
Reel/Frame 035858/0092 →
Release of Security Interest
Jun 8, 2015
From: WACHOVIA CAPITAL FINANCE CORPORATION (NEW ENGLAND)
To: MERIX CORPORATION
Reel/Frame 035857/0333 →
Patent Security Agreement-Term
Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035851/0928 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (035858/0890)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TTM TECHNOLOGIES, INC. (FORMERLY KNOWN AS VIASYSTEMS GROUP, INC. AND VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (FORMERLY KNOWN AS VIASYSTEMS TECHNOLOGIES CORP., L.L.C.)
Reel/Frame 075681/0922 →