Patent Assignment
Reel/Frame 021489/0443
Assignment of Assignor's Interest
Recorded: 2008-08-28
Pages: 4
Assignor
HITACHI, LTD.
Executed: 2008-08-25
Assignee
RENESAS TECHNOLOGY CORP.
6-2, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Properties
(9)
Semiconductor Device Including Multi-Layer Conductive Thin Film of Polycrystalline Material
Patent:
5,444,302 →
Application:
08/168,506 →
Semiconductor Apparatus Having Conductive Thin Films and Manufacturing Apparatus Therefor
Application:
08/432,065 →
Apparatus for Manufacturing a Semiconductor Device Having Conductive Thin Films
Patent:
5,683,515 →
Application:
08/534,118 →
Semiconductor Apparatus Having Conductive Thin Films
Patent:
6,118,140 →
Application:
08/749,324 →
Semiconductor Apparatus Having Conductive Thin Films and Manufacturing Apparatus Therefor
Patent:
6,043,142 →
Application:
08/985,179 →
Semiconductor apparatus having conductive thin films
Patent:
6,346,731 →
Application:
09/499,898 →
Semiconductor Apparatus Having Conductive Thin Films and Manufacturing Apparatus Therefor
Patent:
6,468,845 →
Application:
09/536,642 →
Method of Manufacturing Semiconductor Device Having Conductive Thin Films
Method of Manufacturing Semiconductor Device Having Conductive Thin Films
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 26, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014569/0585 →
Merger
Mar 25, 2011
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 026109/0269 →
Merger/Change of Name
Aug 31, 2011
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 026837/0505 →