Patent Assignment
Reel/Frame 021537/0918
Assignment of Assignor's Interest
Recorded: 2008-09-16
Pages: 7
Assignors
TAKIAR, HEM
Executed: 2008-09-12
BHAGATH, SHRIKAR
Executed: 2008-09-12
YU, CHEEMEN
Executed: 2008-09-11
LIAO, CHIH-CHIN
Executed: 2008-06-30
Assignee
SANDISK CORPORATION
601 MCCARTHY BOULEVARD, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Method of Fabricating Stacked Semiconductor Package with Localized Cavities for Wire Bonding
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 13, 2011
From: SANDISK CORPORATION
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 026278/0647 →
Change of Name
May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038809/0600 →
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →