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Patent Assignment
Reel/Frame 026278/0647

Assignment of Assignor's Interest

Recorded: 2011-05-13 Pages: 6
Assignor
SANDISK CORPORATION
Executed: 2011-04-04
Assignee
SANDISK TECHNOLOGIES INC.
6900 NORTH DALLAS PARKWAY, TWO LEGACY TOWN CENTER, PLANO, TEXAS, 75024
Covered Property (1)
Method of Fabricating Stacked Semiconductor Package with Localized Cavities for Wire Bonding
Patent: 8,470,640 →
Application: 12/165,297 →
Publication: US 2009/0325342
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 16, 2008
From: TAKIAR, HEM; BHAGATH, SHRIKAR; YU, CHEEMEN; LIAO, CHIH-CHIN
To: SANDISK CORPORATION
Reel/Frame 021537/0918 →
Change of Name May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038809/0600 →
Assignment of Assignor's Interest Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Partial Release of Security Interests Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
Security Agreement Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →