IP Library Assignment 021543/0698
Patent Assignment
Reel/Frame 021543/0698

Assignment of Assignor's Interest

Recorded: 2008-09-09 Pages: 2
Assignors
DAS, RABINDRA N.
Executed: 2008-09-02
LAUFFER, JOHN M.
Executed: 2008-09-02
MEMIS, I. (NMN)
Executed: 2008-09-02
ROSSER, STEVEN G.
Executed: 2008-09-02
Assignee
ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
1093 CLARK STREET, ENDICOTT, NEW YORK, 13760
Covered Property (1)
Multi-Layer Embedded Capacitance and Resistance Substrate Core
Patent: 7,791,897 →
Application: 12/283,146 →
Publication: US 2010/0060381
Related Assignments (11)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement May 14, 2012
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.; EI TRANSPORTATION COMPANY LLC; ENDICOTT MEDTECH, INC.
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 028230/0798 →
Assignment of Security Agreement Mar 6, 2013
From: PNC BANK, NATIONAL ASSOCIATION
To: INTEGRIAN HOLDINGS, LLC
Reel/Frame 029938/0823 →
Security Agreement May 6, 2013
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.; EI TRANSPORTATION COMPANY LLC; ENDICOTT MEDTECH, INC.; INTEGRIAN HOLDINGS, LLC
To: M&T BANK
Reel/Frame 030359/0057 →
Security Agreement Jun 12, 2013
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
To: MAINES, WILLIAM; MAINES, DAVID
Reel/Frame 030599/0918 →
Release of Security Interest Feb 26, 2015
From: MAINES, WILLIAM; MAINES, DAVID
To: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
Reel/Frame 035098/0968 →
Assignment of Assignor's Interest Apr 16, 2015
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
To: I3 ELECTRONICS, INC.
Reel/Frame 035442/0569 →
Security Interest Nov 14, 2016
From: I3 ELECTRONICS, INC.
To: M&T BANK
Reel/Frame 040608/0626 →
Assignment of Assignor's Interest Jul 15, 2019
From: I3 ELECTRONICS, INC.
To: TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 049758/0265 →
Patent Security Agreement (Abl) May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
Patent Security Agreement (Term Loan) May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (063804/0702) Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075679/0852 →