Multi-layer embedded capacitance and resistance substrate core
View Patent ↗A multi-layer imbedded capacitance and resistance substrate core. At least one layer of resistance material is provided. The layer of resistance material has a layer of electrically conductive material embedded therein. At least one layer of capacitance material of high dielectric constant is disposed on the layer of resistance material. Thru-holes are formed by laser.
1. A multi-layer embedded capacitance and resistance substrate core, comprising:
a) at least one layer of resistance material on a laser drillable dielectric, said one layer of resistance material having a patterned layer of electrically conductive material embedded therein;
b) a first patterned electrically conductive layer disposed on said first patterned resistance layer;
c) a capacitance layer disposed on said first patterned electrically conductive layer, said capacitance layer having non-uniform thickness;
d) a second resistance layer disposed on said capacitance layer; and a second electrically conductive layer disposed on said second resistance layer; and
e) a plurality of thru-holes formed by laser.
2. The multi-layer embedded capacitance and resistance substrate core in accordance with claim 1 , wherein said laser drillable dielectric material has a layer of resistance and capacitance material on both sides thereof.
3. The multi-layer embedded capacitance and resistance substrate core in accordance with claim 1 , wherein said at least one layer of capacitance material comprises a plurality of capacitance layers having variable capacitance density.
4. The multi-layer embedded capacitance and resistance substrate core in accordance with claim 1 , wherein said laser dielectric material has controlled CTE ranging from approximately 7-15 ppm.
5. The multi-layer embedded capacitance and resistance substrate core in accordance with claim 1 , wherein said conductive layer bonded to said capacitance layer comprises a layer of resistance material comprising a layer of electrically conductive material therein.
6. The multi-layer embedded capacitance and resistance substrate core in accordance with claim 1 , further comprising:
e) at least one other layer of capacitance material partially covering said substrate core, whereby a capacitance at a first predetermined position relative to said substrate is different from the capacitance at a second predetermined position relative to said substrate.
7. The multi-layer embedded capacitance and resistance substrate core in accordance with claim 1 , further comprising:
e) at least one other layer of resistance material partially covering said substrate core, whereby a resistance at a first predetermined position relative to said substrate is different from the resistance at a second predetermined position relative to said substrate.
8. The multi-layer embedded capacitance and resistance substrate core in accordance with claim 6 , further comprising:
f) at least one other layer of resistance material partially covering said substrate core, whereby a resistance at a first predetermined position relative to said substrate is different from the resistance at a second predetermined position relative to said substrate and whereby a capacitance at a third predetermined position relative to said substrate is different from the capacitance at a fourth predetermined position relative to said substrate.
9. An information handling system comprising a multi-layer embedded capacitance and resistance substrate core, said core comprising:
a) at least one layer of resistance material;
b) a first patterned electrically conductive layer disposed on said first patterned resistance layer;
c) a capacitance layer disposed on said first patterned electrically conductive layer, said capacitance layer having non-uniform thickness;
d) a second resistance layer disposed on said capacitance layer; and
e) a second electrically conductive layer disposed on said second resistance layer;
f) a plurality of thru-holes formed by laser.
10. The information handling system of claim 9 wherein said at least one layer of resistance material comprises dielectric material.
11. The information handling system of claim 9 wherein said at least one layer of capacitance material comprises a plurality of capacitance layers having variable capacitance density.
12. The information handling system of claim 10 wherein said at least one layer of capacitance material comprises a plurality of capacitance layers each having a different capacitance density.
13. The information handling system of claim 9 wherein the number of said layers of resistance material is greater than the number of said layer(s) of capacitance material by two.
14. A multi-layer embedded capacitance and resistance substrate core, comprising:
b) a first laser-drillable dielectric layer;
c) a first patterned resistance layer disposed on said first dielectric layer;
d) a first patterned electrically conductive layer disposed on said first patterned resistance layer;
e) a capacitance layer disposed on said first patterned electrically conductive layer;
f) a second resistance layer disposed on said capacitance layer; and
g) a second electrically conductive layer disposed on said second resistance layer;
whereby a crenellated capacitance layer is formed between said first laser-drillable dielectric layer and said second electrically conductive layer.