Patent Assignment
Reel/Frame 021850/0800
Change of Name
Recorded: 2008-11-18
Pages: 4
Assignor
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Executed: 2008-10-01
Assignee
PANASONIC CORPORATION
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Properties
(9)
Interconnecting structure with dummy vias
Application:
10/791,751 →
Publication:
US 2005/0035457
Semiconductor device with interconnections formed in low dielectric constant films containing silicon,oxygen,carbon,and nitrogen
Application:
11/344,102 →
Publication:
US 2006/0175705
Semiconductor Device and Method for Fabricating the Same
Semiconductor Device and Manufacturing Method of the Same
Application:
11/565,913 →
Publication:
US 2007/0138573
Semiconductor device and manufacturing method thereof
Application:
11/646,422 →
Publication:
US 2007/0145600
Semiconductor device and manufacturing method therof
Application:
11/646,432 →
Publication:
US 2007/0145591
Semiconductor Substrate Cleaning Method and Semiconductor Substrate Cleaning Machine
Manufacturing method of semiconductor device and semiconductor device
Application:
11/907,998 →
Publication:
US 2008/0093709
Method for Fabricating Semiconductor Device
Related Assignments
(12)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 4, 2004
From: TOMITA, KAZUO; HASHIMOTO, KEIJI; NISHIOKA, YASUTAKA; MATSUMOTO, SUSUMU
To: RENESAS TECHNOLOGY CORP.; MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 015047/0949 →
Assignment of Assignor's Interest
Jun 13, 2006
From: TSUTSUE, MAKOTO; GOTO, KINYA
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.; RENESAS TECHNOLOGY, CORP.
Reel/Frame 017765/0828 →
Assignment of Assignor's Interest
Sep 19, 2006
From: HAMADA, MASAKAZU; MAEKAWA, KAZUYOSHI; MORI, KENICHI
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.; RENESAS TECHNOLOGY, CORP.
Reel/Frame 018269/0673 →
Assignment of Assignor's Interest
Mar 2, 2007
From: KASHIHARA, KEIICHIRO; OKUDAIRA, TOMONORI; YAMAGUCHI, TADASHI; ISHINAGA, ATSUSHI
To: RENESAS TECHNOLOGY CORP.; MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 018954/0583 →
Assignment of Assignor's Interest
Jun 4, 2007
From: YANO, HISASHI; HAMADA, MASAKAZU; MAEKAWA, KAZUYOSHI; MORI, KENICHI
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.; RENESAS TECHNOLOGY, CORP.
Reel/Frame 019377/0670 →
Assignment of Assignor's Interest
Jul 22, 2007
From: YANO, HISASHI; HAMADA, MASAKAZU; MAEKAWA, KAZUYOSHI; MORI, KENICHI
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.; RENESAS TECHNOLOGY, CORP.
Reel/Frame 019586/0275 →
Assignment of Assignor's Interest
Oct 19, 2007
From: MATSUURA, MASAZUMI; GOTO, KINYA; YANO, HISASHI; NOMURA, KOTARO
To: RENESAS TECHNOLOGY CORP.; MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 020036/0779 →
Assignment of Assignor's Interest
Dec 13, 2007
From: KOBAYASHI, KENJI; OSHITA, HIROSHI
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.; RENESAS TECHNOLOGY CORP.
Reel/Frame 020245/0481 →
Assignment of Assignor's Interest
Jul 22, 2008
From: UEKI, AKIRA; HARADA, TAKESHI; ISHII, ATSUSHI
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.; RENESAS TECHNOLOGY CORP.
Reel/Frame 021275/0430 →
Change of Name
Sep 1, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024915/0526 →
Merger
Sep 1, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024915/0556 →
Change of Name
Sep 9, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025008/0390 →