IP Library › Assignment 023496/0734
Patent Assignment
Reel/Frame 023496/0734

Assignment of Assignor's Interest

Recorded: 2009-11-10 Pages: 3
Assignors
LIN, DIANN-FANG
Executed: 2009-10-08
HU, YU-SHAN
Executed: 2009-10-08
Assignee
ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
NO. 65, GUANGFU N. RD., HUKOU TOWNSHIP, HSINCHU COUNTY, 303, TAIWAN
Covered Property (1)
Package Structure and Manufacturing Method Thereof
Patent: 8,058,102 →
Application: 12/615,682 →
Publication: US 2011/0108977
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Jul 31, 2023
From: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
To: ADL ENGINEERING INC.
Reel/Frame 064438/0067 →
Change of Name Jul 31, 2023
From: ADL ENGINEERING INC.
To: ADL ENERGY CORP.
Reel/Frame 064444/0857 →
Assignment of Assignor's Interest Oct 27, 2023
From: ADL ENERGY CORP.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 065373/0830 →