IP Library › Assignment 064444/0857
Patent Assignment
Reel/Frame 064444/0857

Change of Name

Recorded: 2023-07-31 Pages: 6
Assignor
ADL ENGINEERING INC.
Executed: 2022-01-05
Assignee
ADL ENERGY CORP.
4F, NO. 38, SHENGLI 2ND RD., ZHUBEI CITY, HSINCHU COUNTY, 302, TAIWAN
Covered Properties (2)
Package Structure and Manufacturing Method Thereof
Patent: 8,058,102 →
Application: 12/615,682 →
Publication: US 2011/0108977
Package Structure
Patent: 8,749,048 →
Application: 13/091,484 →
Publication: US 2011/0193216
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 10, 2009
From: LIN, DIANN-FANG; HU, YU-SHAN
To: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
Reel/Frame 023496/0734 →
Merger Apr 28, 2014
From: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
To: ADL ENGINEERING INC.
Reel/Frame 032766/0183 →
Merger Jul 31, 2023
From: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
To: ADL ENGINEERING INC.
Reel/Frame 064438/0067 →
Assignment of Assignor's Interest Oct 27, 2023
From: ADL ENERGY CORP.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 065373/0830 →
Assignment of Assignor's Interest Oct 27, 2023
From: ADL ENERGY CORP.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 065373/0847 →