Patent Assignment
Reel/Frame 065373/0830
Assignment of Assignor's Interest
Recorded: 2023-10-27
Pages: 2
Assignor
ADL ENERGY CORP.
Executed: 2023-08-25
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Package Structure and Manufacturing Method Thereof
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 10, 2009
From: LIN, DIANN-FANG; HU, YU-SHAN
To: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
Reel/Frame 023496/0734 →
Merger
Jul 31, 2023
From: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
To: ADL ENGINEERING INC.
Reel/Frame 064438/0067 →
Change of Name
Jul 31, 2023
From: ADL ENGINEERING INC.
To: ADL ENERGY CORP.
Reel/Frame 064444/0857 →